Polishing pad, method for manufacturing polishing pad and polishing apparatus

The present invention relates to a polishing pad including a polishing layer. The polishing layer includes a plurality of foaming pores, and a diameter of each of the foaming pores is 1 [mu]m to 10 [mu]m. The invention also relates to a method for manufacturing a polishing pad and a polishing appara...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SONG, HSIN-RU, WU, JENG-YI, HUNG, YUNGANG, HUNG, HSIENANG, YAO, I-PENG, WANG, LYANG-GUNG, HUANG, CHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GENERAL PROCESSES OF COMPOUNDING GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS POLISHING THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention relates to a polishing pad including a polishing layer. The polishing layer includes a plurality of foaming pores, and a diameter of each of the foaming pores is 1 [mu]m to 10 [mu]m. The invention also relates to a method for manufacturing a polishing pad and a polishing apparatus.