Interconnect structure and methods of forming the same

An interconnect structure and methods of forming the same are described. In some embodiments, the structure includes a first dielectric layer disposed over one or more devices, a first conductive feature disposed in the first dielectric layer, a second conductive feature disposed in the first dielec...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	CHIN, SHUNG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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