Substrate preparation chamber with substrate positioning features
A substrate preparation chamber is described herein. The substrate preparation chamber comprises an enclosure, a rotatable substrate support disposed within the enclosure, and an atmosphere replacement system coupled to the enclosure. The substrate preparation chamber can be used with an inkjet prin...
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| creator | BUCHNER, CHRISTOPHER NORDHOFF, KARL ANDREW KO, ALEXANDER SOU-KANG |
| description | A substrate preparation chamber is described herein. The substrate preparation chamber comprises an enclosure, a rotatable substrate support disposed within the enclosure, and an atmosphere replacement system coupled to the enclosure. The substrate preparation chamber can be used with an inkjet printing system, where the substrate preparation chamber is coupled to a printing enclosure such that a door is operable to place the enclosure of the substrate preparation chamber in fluid communication with the printing enclosure. |
| format | Patent |
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The substrate preparation chamber comprises an enclosure, a rotatable substrate support disposed within the enclosure, and an atmosphere replacement system coupled to the enclosure. The substrate preparation chamber can be used with an inkjet printing system, where the substrate preparation chamber is coupled to a printing enclosure such that a door is operable to place the enclosure of the substrate preparation chamber in fluid communication with the printing enclosure.</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; CORRECTION OF TYPOGRAPHICAL ERRORS ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; LINING MACHINES ; METALLURGY ; PERFORMING OPERATIONS ; PRINTING ; SELECTIVE PRINTING MECHANISMS ; SEMICONDUCTOR DEVICES ; STAMPS ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION ; TRANSPORTING ; TYPEWRITERS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230716&DB=EPODOC&CC=TW&NR=202329311A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230716&DB=EPODOC&CC=TW&NR=202329311A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>BUCHNER, CHRISTOPHER</creatorcontrib><creatorcontrib>NORDHOFF, KARL ANDREW</creatorcontrib><creatorcontrib>KO, ALEXANDER SOU-KANG</creatorcontrib><title>Substrate preparation chamber with substrate positioning features</title><description>A substrate preparation chamber is described herein. The substrate preparation chamber comprises an enclosure, a rotatable substrate support disposed within the enclosure, and an atmosphere replacement system coupled to the enclosure. The substrate preparation chamber can be used with an inkjet printing system, where the substrate preparation chamber is coupled to a printing enclosure such that a door is operable to place the enclosure of the substrate preparation chamber in fluid communication with the printing enclosure.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>CORRECTION OF TYPOGRAPHICAL ERRORS</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>LINING MACHINES</subject><subject>METALLURGY</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTING</subject><subject>SELECTIVE PRINTING MECHANISMS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>STAMPS</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><subject>TRANSPORTING</subject><subject>TYPEWRITERS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAMLk0qLilKLElVKChKLUgEsjLz8xSSMxJzk1KLFMozSzIUihFK8oszQfKZeekKaamJJaVFqcU8DKxpiTnFqbxQmptB0c01xNlDN7UgPz61uCAxOTUvtSQ-JNzIwMjYyNLY0NDRmBg1AI37Muk</recordid><startdate>20230716</startdate><enddate>20230716</enddate><creator>BUCHNER, CHRISTOPHER</creator><creator>NORDHOFF, KARL ANDREW</creator><creator>KO, ALEXANDER SOU-KANG</creator><scope>EVB</scope></search><sort><creationdate>20230716</creationdate><title>Substrate preparation chamber with substrate positioning features</title><author>BUCHNER, CHRISTOPHER ; NORDHOFF, KARL ANDREW ; KO, ALEXANDER SOU-KANG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW202329311A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>CORRECTION OF TYPOGRAPHICAL ERRORS</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>LINING MACHINES</topic><topic>METALLURGY</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTING</topic><topic>SELECTIVE PRINTING MECHANISMS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>STAMPS</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><topic>TRANSPORTING</topic><topic>TYPEWRITERS</topic><toplevel>online_resources</toplevel><creatorcontrib>BUCHNER, CHRISTOPHER</creatorcontrib><creatorcontrib>NORDHOFF, KARL ANDREW</creatorcontrib><creatorcontrib>KO, ALEXANDER SOU-KANG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>BUCHNER, CHRISTOPHER</au><au>NORDHOFF, KARL ANDREW</au><au>KO, ALEXANDER SOU-KANG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Substrate preparation chamber with substrate positioning features</title><date>2023-07-16</date><risdate>2023</risdate><abstract>A substrate preparation chamber is described herein. The substrate preparation chamber comprises an enclosure, a rotatable substrate support disposed within the enclosure, and an atmosphere replacement system coupled to the enclosure. The substrate preparation chamber can be used with an inkjet printing system, where the substrate preparation chamber is coupled to a printing enclosure such that a door is operable to place the enclosure of the substrate preparation chamber in fluid communication with the printing enclosure.</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CORRECTION OF TYPOGRAPHICAL ERRORS DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL LINING MACHINES METALLURGY PERFORMING OPERATIONS PRINTING SELECTIVE PRINTING MECHANISMS SEMICONDUCTOR DEVICES STAMPS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING TYPEWRITERS |
| title | Substrate preparation chamber with substrate positioning features |
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