Protection material for electronic circuit, method of sealing, method of producing semiconductor device, and material for sealing
A protection material for an electronic circuit that satisfies at least one of following (1) or (2):(1) contains a resin component and an inorganic filler, and a content of the inorganic filler is 50% by mass or more of the total amount. (2) contains a resin component and an inorganic filler, and ha...
Gespeichert in:
| Hauptverfasser: | , , , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | KANG, DONGUL YAMAURA, MASASHI HORI, KOHJI ISHIBASHI, KENTA |
| description | A protection material for an electronic circuit that satisfies at least one of following (1) or (2):(1) contains a resin component and an inorganic filler, and a content of the inorganic filler is 50% by mass or more of the total amount. (2) contains a resin component and an inorganic filler, and has a thixotropic index at 75 DEG C of from 0.1 to 2.5, which is a value given as viscosity A / viscosity B, where viscosity A is a viscosity (Pa.s) as measured at 75 DEG C and a shear rate of 5 s-1 and viscosity B is a viscosity (Pa.s) as measured at 75 DEG C and a shear rate of 50 s-1. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TW202328334A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TW202328334A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TW202328334A3</originalsourceid><addsrcrecordid>eNqNjbEKwkAQRNNYiPoPax9Bcha2QRRLi4BlOPY2unC5Pe429v65V6TQzmqYN8PMsnrfkiihsgQYrVJi62GQBOQLTRIYATnhxFrDSPoUBzJAJus5PL5RTOImLLCEI6OE4rQMOXoxUg02uN-HeWNdLQbrM21mXVXby7k7XXcUpaccLVIg7bt7s29MczTm0Jp_Oh-x1Enj</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Protection material for electronic circuit, method of sealing, method of producing semiconductor device, and material for sealing</title><source>esp@cenet</source><creator>KANG, DONGUL ; YAMAURA, MASASHI ; HORI, KOHJI ; ISHIBASHI, KENTA</creator><creatorcontrib>KANG, DONGUL ; YAMAURA, MASASHI ; HORI, KOHJI ; ISHIBASHI, KENTA</creatorcontrib><description>A protection material for an electronic circuit that satisfies at least one of following (1) or (2):(1) contains a resin component and an inorganic filler, and a content of the inorganic filler is 50% by mass or more of the total amount. (2) contains a resin component and an inorganic filler, and has a thixotropic index at 75 DEG C of from 0.1 to 2.5, which is a value given as viscosity A / viscosity B, where viscosity A is a viscosity (Pa.s) as measured at 75 DEG C and a shear rate of 5 s-1 and viscosity B is a viscosity (Pa.s) as measured at 75 DEG C and a shear rate of 50 s-1.</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; SEMICONDUCTOR DEVICES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230716&DB=EPODOC&CC=TW&NR=202328334A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230716&DB=EPODOC&CC=TW&NR=202328334A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KANG, DONGUL</creatorcontrib><creatorcontrib>YAMAURA, MASASHI</creatorcontrib><creatorcontrib>HORI, KOHJI</creatorcontrib><creatorcontrib>ISHIBASHI, KENTA</creatorcontrib><title>Protection material for electronic circuit, method of sealing, method of producing semiconductor device, and material for sealing</title><description>A protection material for an electronic circuit that satisfies at least one of following (1) or (2):(1) contains a resin component and an inorganic filler, and a content of the inorganic filler is 50% by mass or more of the total amount. (2) contains a resin component and an inorganic filler, and has a thixotropic index at 75 DEG C of from 0.1 to 2.5, which is a value given as viscosity A / viscosity B, where viscosity A is a viscosity (Pa.s) as measured at 75 DEG C and a shear rate of 5 s-1 and viscosity B is a viscosity (Pa.s) as measured at 75 DEG C and a shear rate of 50 s-1.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjbEKwkAQRNNYiPoPax9Bcha2QRRLi4BlOPY2unC5Pe429v65V6TQzmqYN8PMsnrfkiihsgQYrVJi62GQBOQLTRIYATnhxFrDSPoUBzJAJus5PL5RTOImLLCEI6OE4rQMOXoxUg02uN-HeWNdLQbrM21mXVXby7k7XXcUpaccLVIg7bt7s29MczTm0Jp_Oh-x1Enj</recordid><startdate>20230716</startdate><enddate>20230716</enddate><creator>KANG, DONGUL</creator><creator>YAMAURA, MASASHI</creator><creator>HORI, KOHJI</creator><creator>ISHIBASHI, KENTA</creator><scope>EVB</scope></search><sort><creationdate>20230716</creationdate><title>Protection material for electronic circuit, method of sealing, method of producing semiconductor device, and material for sealing</title><author>KANG, DONGUL ; YAMAURA, MASASHI ; HORI, KOHJI ; ISHIBASHI, KENTA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW202328334A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><toplevel>online_resources</toplevel><creatorcontrib>KANG, DONGUL</creatorcontrib><creatorcontrib>YAMAURA, MASASHI</creatorcontrib><creatorcontrib>HORI, KOHJI</creatorcontrib><creatorcontrib>ISHIBASHI, KENTA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KANG, DONGUL</au><au>YAMAURA, MASASHI</au><au>HORI, KOHJI</au><au>ISHIBASHI, KENTA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Protection material for electronic circuit, method of sealing, method of producing semiconductor device, and material for sealing</title><date>2023-07-16</date><risdate>2023</risdate><abstract>A protection material for an electronic circuit that satisfies at least one of following (1) or (2):(1) contains a resin component and an inorganic filler, and a content of the inorganic filler is 50% by mass or more of the total amount. (2) contains a resin component and an inorganic filler, and has a thixotropic index at 75 DEG C of from 0.1 to 2.5, which is a value given as viscosity A / viscosity B, where viscosity A is a viscosity (Pa.s) as measured at 75 DEG C and a shear rate of 5 s-1 and viscosity B is a viscosity (Pa.s) as measured at 75 DEG C and a shear rate of 50 s-1.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_TW202328334A |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
| title | Protection material for electronic circuit, method of sealing, method of producing semiconductor device, and material for sealing |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-26T17%3A03%3A36IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KANG,%20DONGUL&rft.date=2023-07-16&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETW202328334A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |