Chamber and methods of cooling a substrate after baking

A method and apparatus for performing post-exposure bake cooling operations is described herein. The method begins by post exposure baking a substrate disposed on heated substrate support in a process chamber, the process chamber having a showerhead. The heated substrate support is moved to increase...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LUBOMIRSKY, DMITRY, TSO, ALAN L, BUCHBERGER JR., DOUGLAS A, LIANG, QIWEI, YIEH, ELLIE Y, KIM, HYUN-JUN, ATHANI, SHEKHAR
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY PLASMA TECHNIQUE PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS SEMICONDUCTOR DEVICES
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