Parameter optimization method of laser engraving machine applied to RO3003
1. The processing of printed circuit boards and the laser engraving and etching process are different from the traditional wet process. In the stage of product research, a relatively wet method, laser engraving and ablation process has the advantages of fast technology, no mask, no waste gas and no...
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| creator | LIAO, YING-TING CHEN, YIHIEN |
| description | 1. The processing of printed circuit boards and the laser engraving and etching process are different from the traditional wet process. In the stage of product research, a relatively wet method, laser engraving and ablation process has the advantages of fast technology, no mask, no waste gas and no waste liquid, etc., can use laser light to process a certain material, It can be judged by the wavelength of the laser light and the light absorption rate of the material. This article uses LPKF ProtoLaser U4 from LPKF Laser & Electronics (company) to ablate and cut RO3003 copper clad laminates and self-manufactured products after printing silver glue to structure them with circuits. |
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The processing of printed circuit boards and the laser engraving and etching process are different from the traditional wet process. In the stage of product research, a relatively wet method, laser engraving and ablation process has the advantages of fast technology, no mask, no waste gas and no waste liquid, etc., can use laser light to process a certain material, It can be judged by the wavelength of the laser light and the light absorption rate of the material. 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The processing of printed circuit boards and the laser engraving and etching process are different from the traditional wet process. In the stage of product research, a relatively wet method, laser engraving and ablation process has the advantages of fast technology, no mask, no waste gas and no waste liquid, etc., can use laser light to process a certain material, It can be judged by the wavelength of the laser light and the light absorption rate of the material. This article uses LPKF ProtoLaser U4 from LPKF Laser & Electronics (company) to ablate and cut RO3003 copper clad laminates and self-manufactured products after printing silver glue to structure them with circuits.</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | Parameter optimization method of laser engraving machine applied to RO3003 |
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