Mm wave antenna module package structure and manufacturing method thereof
A millimeter wave antenna module package structure includes a first group of circuit structure, a second group of wiring structure, and a plurality of joints. The first group of circuit structure includes at least one first wiring layer and a plurality of first conductive connections, and at least o...
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| creator | HU, DYIUNG |
| description | A millimeter wave antenna module package structure includes a first group of circuit structure, a second group of wiring structure, and a plurality of joints. The first group of circuit structure includes at least one first wiring layer and a plurality of first conductive connections, and at least one first wiring layer includes an antenna pattern. The second group of circuit structure includes a plurality of second wiring layers and a plurality of second conductive connections. The joints are disposed between the first group of circuit structure and the second group of circuit structure. The joints are connected to the first conductive connections and the second conductive connections, so that the first group of circuit structure is electrically connected to the second group of circuit structure to form a multi-layer redistribution structure. A manufacturing method of the millimeter wave antenna module package structure is also provided. |
| format | Patent |
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The first group of circuit structure includes at least one first wiring layer and a plurality of first conductive connections, and at least one first wiring layer includes an antenna pattern. The second group of circuit structure includes a plurality of second wiring layers and a plurality of second conductive connections. The joints are disposed between the first group of circuit structure and the second group of circuit structure. The joints are connected to the first conductive connections and the second conductive connections, so that the first group of circuit structure is electrically connected to the second group of circuit structure to form a multi-layer redistribution structure. A manufacturing method of the millimeter wave antenna module package structure is also provided.</description><language>chi ; eng</language><subject>ANTENNAS, i.e. RADIO AERIALS ; BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230516&DB=EPODOC&CC=TW&NR=202320251A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230516&DB=EPODOC&CC=TW&NR=202320251A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HU, DYIUNG</creatorcontrib><title>Mm wave antenna module package structure and manufacturing method thereof</title><description>A millimeter wave antenna module package structure includes a first group of circuit structure, a second group of wiring structure, and a plurality of joints. The first group of circuit structure includes at least one first wiring layer and a plurality of first conductive connections, and at least one first wiring layer includes an antenna pattern. The second group of circuit structure includes a plurality of second wiring layers and a plurality of second conductive connections. The joints are disposed between the first group of circuit structure and the second group of circuit structure. The joints are connected to the first conductive connections and the second conductive connections, so that the first group of circuit structure is electrically connected to the second group of circuit structure to form a multi-layer redistribution structure. A manufacturing method of the millimeter wave antenna module package structure is also provided.</description><subject>ANTENNAS, i.e. RADIO AERIALS</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPD0zVUoTyxLVUjMK0nNy0tUyM1PKc1JVShITM5OTE9VKC4pKk0uKS0CKUhRyE3MK01LBPEz89IVclNLMvJTFEoyUotS89N4GFjTEnOKU3mhNDeDoptriLOHbmpBfnxqMdDA1LzUkviQcCMDI2MgNjV0NCZGDQD9RTUQ</recordid><startdate>20230516</startdate><enddate>20230516</enddate><creator>HU, DYIUNG</creator><scope>EVB</scope></search><sort><creationdate>20230516</creationdate><title>Mm wave antenna module package structure and manufacturing method thereof</title><author>HU, DYIUNG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW202320251A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>ANTENNAS, i.e. RADIO AERIALS</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>HU, DYIUNG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HU, DYIUNG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Mm wave antenna module package structure and manufacturing method thereof</title><date>2023-05-16</date><risdate>2023</risdate><abstract>A millimeter wave antenna module package structure includes a first group of circuit structure, a second group of wiring structure, and a plurality of joints. The first group of circuit structure includes at least one first wiring layer and a plurality of first conductive connections, and at least one first wiring layer includes an antenna pattern. The second group of circuit structure includes a plurality of second wiring layers and a plurality of second conductive connections. The joints are disposed between the first group of circuit structure and the second group of circuit structure. The joints are connected to the first conductive connections and the second conductive connections, so that the first group of circuit structure is electrically connected to the second group of circuit structure to form a multi-layer redistribution structure. A manufacturing method of the millimeter wave antenna module package structure is also provided.</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Mm wave antenna module package structure and manufacturing method thereof |
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