Methods for preparing void-free coatings for plasma treatment components
Methods for preparing a void-free protective coating are disclosed herein. The void-free protective coating is used on a dielectric window having a central hole, which is used in a plasma treatment tool. A first protective coating layer is applied to the window, leaving an uncoated annular retreat a...
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| creator | WANG, CHIEN-YU CHEN, SHIH-TSUNG WANG, YEN-SHIH PAI, JIUN-RONG HO, TSUNGNG WANG, YEHIEH |
| description | Methods for preparing a void-free protective coating are disclosed herein. The void-free protective coating is used on a dielectric window having a central hole, which is used in a plasma treatment tool. A first protective coating layer is applied to the window, leaving an uncoated annular retreat area around the central hole. The first protective coating layer is polished to produce a flat surface and fill in any voids on the window. A second protective coating layer is then applied upon the flat surface of the first protective coating layer to obtain the void-free coating. This increases process uptime and service lifetime of the dielectric window and the plasma treatment tool. |
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The void-free protective coating is used on a dielectric window having a central hole, which is used in a plasma treatment tool. A first protective coating layer is applied to the window, leaving an uncoated annular retreat area around the central hole. The first protective coating layer is polished to produce a flat surface and fill in any voids on the window. A second protective coating layer is then applied upon the flat surface of the first protective coating layer to obtain the void-free coating. 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This increases process uptime and service lifetime of the dielectric window and the plasma treatment tool.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPDwTS3JyE8pVkjLL1IoKEotSCzKzEtXKMvPTNFNK0pNVUjOTywBikAV5CQW5yYqlBSlJpbkpuaVAGVzC_LzgKxiHgbWtMSc4lReKM3NoOjmGuLsoZtakB-fWlyQmJyal1oSHxJuZGBkbGhpambsaEyMGgDbrzT8</recordid><startdate>20230516</startdate><enddate>20230516</enddate><creator>WANG, CHIEN-YU</creator><creator>CHEN, SHIH-TSUNG</creator><creator>WANG, YEN-SHIH</creator><creator>PAI, JIUN-RONG</creator><creator>HO, TSUNGNG</creator><creator>WANG, YEHIEH</creator><scope>EVB</scope></search><sort><creationdate>20230516</creationdate><title>Methods for preparing void-free coatings for plasma treatment components</title><author>WANG, CHIEN-YU ; CHEN, SHIH-TSUNG ; WANG, YEN-SHIH ; PAI, JIUN-RONG ; HO, TSUNGNG ; WANG, YEHIEH</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW202319563A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>WANG, CHIEN-YU</creatorcontrib><creatorcontrib>CHEN, SHIH-TSUNG</creatorcontrib><creatorcontrib>WANG, YEN-SHIH</creatorcontrib><creatorcontrib>PAI, JIUN-RONG</creatorcontrib><creatorcontrib>HO, TSUNGNG</creatorcontrib><creatorcontrib>WANG, YEHIEH</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WANG, CHIEN-YU</au><au>CHEN, SHIH-TSUNG</au><au>WANG, YEN-SHIH</au><au>PAI, JIUN-RONG</au><au>HO, TSUNGNG</au><au>WANG, YEHIEH</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Methods for preparing void-free coatings for plasma treatment components</title><date>2023-05-16</date><risdate>2023</risdate><abstract>Methods for preparing a void-free protective coating are disclosed herein. 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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | Methods for preparing void-free coatings for plasma treatment components |
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