Polishing pads with interconnected pores
Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A polishing pad includes a plurality of polishing elements and a plurality of grooves disposed between the polishing elements. Each polishing element includes a plurality of individual posts. Each post inclu...
Gespeichert in:
| Hauptverfasser: | , , , , , , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | JAWALI, PUNEET NARENDRA FUNG, JASON G BAJAJ, RAJEEV WEWALA GONNAGAHADENIYAGE, SHIYAN AKALANKA JAYANATH CHOCKALINGAM, ASHWIN KAKIREDDY, VEERA RAGHAVA REDDY BARADANAHALLI KENCHAPPA, NANDAN |
| description | Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A polishing pad includes a plurality of polishing elements and a plurality of grooves disposed between the polishing elements. Each polishing element includes a plurality of individual posts. Each post includes an individual surface that forms a portion of a polishing surface of the polishing pad and one or more sidewalls extending downwardly from the individual surface. The sidewalls of the plurality of individual posts define a plurality of pores disposed between the posts. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TW202318495A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TW202318495A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TW202318495A3</originalsourceid><addsrcrecordid>eNrjZNAIyM_JLM7IzEtXKEhMKVYozyzJUMjMK0ktSs7Py0tNLklNUSjIL0ot5mFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8SHhRgZGxoYWJpamjsbEqAEA-F8o1g</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Polishing pads with interconnected pores</title><source>esp@cenet</source><creator>JAWALI, PUNEET NARENDRA ; FUNG, JASON G ; BAJAJ, RAJEEV ; WEWALA GONNAGAHADENIYAGE, SHIYAN AKALANKA JAYANATH ; CHOCKALINGAM, ASHWIN ; KAKIREDDY, VEERA RAGHAVA REDDY ; BARADANAHALLI KENCHAPPA, NANDAN</creator><creatorcontrib>JAWALI, PUNEET NARENDRA ; FUNG, JASON G ; BAJAJ, RAJEEV ; WEWALA GONNAGAHADENIYAGE, SHIYAN AKALANKA JAYANATH ; CHOCKALINGAM, ASHWIN ; KAKIREDDY, VEERA RAGHAVA REDDY ; BARADANAHALLI KENCHAPPA, NANDAN</creatorcontrib><description>Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A polishing pad includes a plurality of polishing elements and a plurality of grooves disposed between the polishing elements. Each polishing element includes a plurality of individual posts. Each post includes an individual surface that forms a portion of a polishing surface of the polishing pad and one or more sidewalls extending downwardly from the individual surface. The sidewalls of the plurality of individual posts define a plurality of pores disposed between the posts.</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230501&DB=EPODOC&CC=TW&NR=202318495A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230501&DB=EPODOC&CC=TW&NR=202318495A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>JAWALI, PUNEET NARENDRA</creatorcontrib><creatorcontrib>FUNG, JASON G</creatorcontrib><creatorcontrib>BAJAJ, RAJEEV</creatorcontrib><creatorcontrib>WEWALA GONNAGAHADENIYAGE, SHIYAN AKALANKA JAYANATH</creatorcontrib><creatorcontrib>CHOCKALINGAM, ASHWIN</creatorcontrib><creatorcontrib>KAKIREDDY, VEERA RAGHAVA REDDY</creatorcontrib><creatorcontrib>BARADANAHALLI KENCHAPPA, NANDAN</creatorcontrib><title>Polishing pads with interconnected pores</title><description>Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A polishing pad includes a plurality of polishing elements and a plurality of grooves disposed between the polishing elements. Each polishing element includes a plurality of individual posts. Each post includes an individual surface that forms a portion of a polishing surface of the polishing pad and one or more sidewalls extending downwardly from the individual surface. The sidewalls of the plurality of individual posts define a plurality of pores disposed between the posts.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAIyM_JLM7IzEtXKEhMKVYozyzJUMjMK0ktSs7Py0tNLklNUSjIL0ot5mFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8SHhRgZGxoYWJpamjsbEqAEA-F8o1g</recordid><startdate>20230501</startdate><enddate>20230501</enddate><creator>JAWALI, PUNEET NARENDRA</creator><creator>FUNG, JASON G</creator><creator>BAJAJ, RAJEEV</creator><creator>WEWALA GONNAGAHADENIYAGE, SHIYAN AKALANKA JAYANATH</creator><creator>CHOCKALINGAM, ASHWIN</creator><creator>KAKIREDDY, VEERA RAGHAVA REDDY</creator><creator>BARADANAHALLI KENCHAPPA, NANDAN</creator><scope>EVB</scope></search><sort><creationdate>20230501</creationdate><title>Polishing pads with interconnected pores</title><author>JAWALI, PUNEET NARENDRA ; FUNG, JASON G ; BAJAJ, RAJEEV ; WEWALA GONNAGAHADENIYAGE, SHIYAN AKALANKA JAYANATH ; CHOCKALINGAM, ASHWIN ; KAKIREDDY, VEERA RAGHAVA REDDY ; BARADANAHALLI KENCHAPPA, NANDAN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW202318495A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>JAWALI, PUNEET NARENDRA</creatorcontrib><creatorcontrib>FUNG, JASON G</creatorcontrib><creatorcontrib>BAJAJ, RAJEEV</creatorcontrib><creatorcontrib>WEWALA GONNAGAHADENIYAGE, SHIYAN AKALANKA JAYANATH</creatorcontrib><creatorcontrib>CHOCKALINGAM, ASHWIN</creatorcontrib><creatorcontrib>KAKIREDDY, VEERA RAGHAVA REDDY</creatorcontrib><creatorcontrib>BARADANAHALLI KENCHAPPA, NANDAN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>JAWALI, PUNEET NARENDRA</au><au>FUNG, JASON G</au><au>BAJAJ, RAJEEV</au><au>WEWALA GONNAGAHADENIYAGE, SHIYAN AKALANKA JAYANATH</au><au>CHOCKALINGAM, ASHWIN</au><au>KAKIREDDY, VEERA RAGHAVA REDDY</au><au>BARADANAHALLI KENCHAPPA, NANDAN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Polishing pads with interconnected pores</title><date>2023-05-01</date><risdate>2023</risdate><abstract>Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A polishing pad includes a plurality of polishing elements and a plurality of grooves disposed between the polishing elements. Each polishing element includes a plurality of individual posts. Each post includes an individual surface that forms a portion of a polishing surface of the polishing pad and one or more sidewalls extending downwardly from the individual surface. The sidewalls of the plurality of individual posts define a plurality of pores disposed between the posts.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_TW202318495A |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING |
| title | Polishing pads with interconnected pores |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-05T13%3A38%3A20IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=JAWALI,%20PUNEET%20NARENDRA&rft.date=2023-05-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETW202318495A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |