Elastic hot glue having low processing temperature capability

The present invention is relates to an elastic hot glue having low processing temperature capability. The elastic hot glue includes a TPU glue layer. The melting point of the TPU glue layer is 60~100 DEG C. The elastic recovery rate of the TPU glue layer is 95-100%. The elastic hot glue of the prese...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	CHIANG, CHIIN, LIN, CHIH-YI, TAI, WEN-HSIN, CHENG, KUO-KUANG, GUO, SHENG-HORNG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present invention is relates to an elastic hot glue having low processing temperature capability. The elastic hot glue includes a TPU glue layer. The melting point of the TPU glue layer is 60~100 DEG C. The elastic recovery rate of the TPU glue layer is 95-100%. The elastic hot glue of the present invention can be widely applied to low processing temperature. The product using the elastic hot glue of the present invention has high elasticity recovery, and strong peeling strength so as to avoid the damage of the product, and increase the life of the product and maintain the appearance of the product.