Processing device and processing conditions setting method

Provided is a processing device that is suitable for reducing the load when a user uses processing results to adjust processing conditions. The processing device 1 performs processing on a workpiece in accordance with processing conditions. The processing conditions include a plurality of items and...

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Bibliographische Detailangaben
Hauptverfasser:	KAWAKATSU, SHOTA, NAKAGAWA, KOYO, ONO, FUMIHIRO, FUKUHARA, SHOGO, INOUE, TOMOKI, INOUE, DAISUKE, SHINOZAKI, EIGO, NAGANO, KYUTARO, TSUGAMI, SEIYA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CONTROL OR REGULATING SYSTEMS IN GENERAL CONTROLLING DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS FUNCTIONAL ELEMENTS OF SUCH SYSTEMS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS PERFORMING OPERATIONS PHYSICS POLISHING REGULATING SEMICONDUCTOR DEVICES TRANSPORTING
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