Processing device and processing conditions setting method
Provided is a processing device that is suitable for reducing the load when a user uses processing results to adjust processing conditions. The processing device 1 performs processing on a workpiece in accordance with processing conditions. The processing conditions include a plurality of items and...
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| creator | KAWAKATSU, SHOTA NAKAGAWA, KOYO ONO, FUMIHIRO FUKUHARA, SHOGO INOUE, TOMOKI INOUE, DAISUKE SHINOZAKI, EIGO NAGANO, KYUTARO TSUGAMI, SEIYA |
| description | Provided is a processing device that is suitable for reducing the load when a user uses processing results to adjust processing conditions. The processing device 1 performs processing on a workpiece in accordance with processing conditions. The processing conditions include a plurality of items and settings for each item. The processing device 1 comprises an individual input processing unit 13, a support input processing unit 15, and an I/O unit 3. The individual input processing unit 13 processes inputs from a user, for the settings for each of the items in the processing conditions. The support input processing unit 15: calculates the amount of change in setting conditions for one or more of the items in the processing conditions, in accordance with a modification of the processing shape for the workpiece input by the user; and displays in the I/O unit 3 at least one item to be modified, as change details, together with the amount of change for each item. |
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The processing device 1 performs processing on a workpiece in accordance with processing conditions. The processing conditions include a plurality of items and settings for each item. The processing device 1 comprises an individual input processing unit 13, a support input processing unit 15, and an I/O unit 3. The individual input processing unit 13 processes inputs from a user, for the settings for each of the items in the processing conditions. The support input processing unit 15: calculates the amount of change in setting conditions for one or more of the items in the processing conditions, in accordance with a modification of the processing shape for the workpiece input by the user; and displays in the I/O unit 3 at least one item to be modified, as change details, together with the amount of change for each item.</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CONTROL OR REGULATING SYSTEMS IN GENERAL ; CONTROLLING ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS ; PERFORMING OPERATIONS ; PHYSICS ; POLISHING ; REGULATING ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230416&DB=EPODOC&CC=TW&NR=202315702A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230416&DB=EPODOC&CC=TW&NR=202315702A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KAWAKATSU, SHOTA</creatorcontrib><creatorcontrib>NAKAGAWA, KOYO</creatorcontrib><creatorcontrib>ONO, FUMIHIRO</creatorcontrib><creatorcontrib>FUKUHARA, SHOGO</creatorcontrib><creatorcontrib>INOUE, TOMOKI</creatorcontrib><creatorcontrib>INOUE, DAISUKE</creatorcontrib><creatorcontrib>SHINOZAKI, EIGO</creatorcontrib><creatorcontrib>NAGANO, KYUTARO</creatorcontrib><creatorcontrib>TSUGAMI, SEIYA</creatorcontrib><title>Processing device and processing conditions setting method</title><description>Provided is a processing device that is suitable for reducing the load when a user uses processing results to adjust processing conditions. 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The processing device 1 performs processing on a workpiece in accordance with processing conditions. The processing conditions include a plurality of items and settings for each item. The processing device 1 comprises an individual input processing unit 13, a support input processing unit 15, and an I/O unit 3. The individual input processing unit 13 processes inputs from a user, for the settings for each of the items in the processing conditions. The support input processing unit 15: calculates the amount of change in setting conditions for one or more of the items in the processing conditions, in accordance with a modification of the processing shape for the workpiece input by the user; and displays in the I/O unit 3 at least one item to be modified, as change details, together with the amount of change for each item.</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS CONTROL OR REGULATING SYSTEMS IN GENERAL CONTROLLING DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS FUNCTIONAL ELEMENTS OF SUCH SYSTEMS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS PERFORMING OPERATIONS PHYSICS POLISHING REGULATING SEMICONDUCTOR DEVICES TRANSPORTING |
| title | Processing device and processing conditions setting method |
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