Substrate drying apparatus, substrate processing apparatus and substrate drying method capable of reducing the occurrence of pattern clogging with a simple configuration
A piece of substrate drying apparatus, a piece of substrate processing apparatus, and a substrate drying method, capable of reducing the occurrence of pattern clogging with a simple configuration, are provided. A substrate drying device (300) in a substrate processing apparatus (1) includes: a heati...
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| creator | MATSUSHITA, JUN TARUNO, YOKO |
| description | A piece of substrate drying apparatus, a piece of substrate processing apparatus, and a substrate drying method, capable of reducing the occurrence of pattern clogging with a simple configuration, are provided. A substrate drying device (300) in a substrate processing apparatus (1) includes: a heating section (36); a first volatile solvent supply section (34); a second volatile solvent supply unit (35) supplying a second volatile solvent (H), wherein the second volatile solvent (H) contains a water repellent agent whose surface tension when vaporized is smaller than the first volatile solvent (V); a drying chamber (31) which the substrate (W) is carried into on which the liquid film is formed; a driving mechanism for rotating the substrate (W); and a control device (400). The first volatile solvent (V) supplied from the first volatile solvent supply section (34) is to replace the liquid film, and the second volatile solvent (H) supplid from the second volatile solvent supply unit (35) is to replace the first |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TW202314921A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TW202314921A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TW202314921A3</originalsourceid><addsrcrecordid>eNqNjL0KwkAQhNNYiPoOa69goo2liGJvwDJs9jaXg-TuuB_ER_ItvUgQ7ayG4ftmptnzGmsfHAYG4R5KS0BrMfXoV-A_zDpD7P0PB9TiSxnnPYfWCCC0WHcMpgHHItKAQps6UXSONb2RxRDYaaDOSDkodxVaQPCqt2lMRjdKxnSvjJ5nkwY7z4sxZ9nyfCqPlzVbU7G3SKw5VOWt2BTbfLcv8sP2H-cFssNaOA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Substrate drying apparatus, substrate processing apparatus and substrate drying method capable of reducing the occurrence of pattern clogging with a simple configuration</title><source>esp@cenet</source><creator>MATSUSHITA, JUN ; TARUNO, YOKO</creator><creatorcontrib>MATSUSHITA, JUN ; TARUNO, YOKO</creatorcontrib><description>A piece of substrate drying apparatus, a piece of substrate processing apparatus, and a substrate drying method, capable of reducing the occurrence of pattern clogging with a simple configuration, are provided. A substrate drying device (300) in a substrate processing apparatus (1) includes: a heating section (36); a first volatile solvent supply section (34); a second volatile solvent supply unit (35) supplying a second volatile solvent (H), wherein the second volatile solvent (H) contains a water repellent agent whose surface tension when vaporized is smaller than the first volatile solvent (V); a drying chamber (31) which the substrate (W) is carried into on which the liquid film is formed; a driving mechanism for rotating the substrate (W); and a control device (400). The first volatile solvent (V) supplied from the first volatile solvent supply section (34) is to replace the liquid film, and the second volatile solvent (H) supplid from the second volatile solvent supply unit (35) is to replace the first</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; BLASTING ; CLEANING ; CLEANING IN GENERAL ; DRYING ; DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HEATING ; LIGHTING ; MECHANICAL ENGINEERING ; PERFORMING OPERATIONS ; PREVENTION OF FOULING IN GENERAL ; SEMICONDUCTOR DEVICES ; TRANSPORTING ; WEAPONS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230401&DB=EPODOC&CC=TW&NR=202314921A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230401&DB=EPODOC&CC=TW&NR=202314921A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MATSUSHITA, JUN</creatorcontrib><creatorcontrib>TARUNO, YOKO</creatorcontrib><title>Substrate drying apparatus, substrate processing apparatus and substrate drying method capable of reducing the occurrence of pattern clogging with a simple configuration</title><description>A piece of substrate drying apparatus, a piece of substrate processing apparatus, and a substrate drying method, capable of reducing the occurrence of pattern clogging with a simple configuration, are provided. A substrate drying device (300) in a substrate processing apparatus (1) includes: a heating section (36); a first volatile solvent supply section (34); a second volatile solvent supply unit (35) supplying a second volatile solvent (H), wherein the second volatile solvent (H) contains a water repellent agent whose surface tension when vaporized is smaller than the first volatile solvent (V); a drying chamber (31) which the substrate (W) is carried into on which the liquid film is formed; a driving mechanism for rotating the substrate (W); and a control device (400). The first volatile solvent (V) supplied from the first volatile solvent supply section (34) is to replace the liquid film, and the second volatile solvent (H) supplid from the second volatile solvent supply unit (35) is to replace the first</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BLASTING</subject><subject>CLEANING</subject><subject>CLEANING IN GENERAL</subject><subject>DRYING</subject><subject>DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HEATING</subject><subject>LIGHTING</subject><subject>MECHANICAL ENGINEERING</subject><subject>PERFORMING OPERATIONS</subject><subject>PREVENTION OF FOULING IN GENERAL</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjL0KwkAQhNNYiPoOa69goo2liGJvwDJs9jaXg-TuuB_ER_ItvUgQ7ayG4ftmptnzGmsfHAYG4R5KS0BrMfXoV-A_zDpD7P0PB9TiSxnnPYfWCCC0WHcMpgHHItKAQps6UXSONb2RxRDYaaDOSDkodxVaQPCqt2lMRjdKxnSvjJ5nkwY7z4sxZ9nyfCqPlzVbU7G3SKw5VOWt2BTbfLcv8sP2H-cFssNaOA</recordid><startdate>20230401</startdate><enddate>20230401</enddate><creator>MATSUSHITA, JUN</creator><creator>TARUNO, YOKO</creator><scope>EVB</scope></search><sort><creationdate>20230401</creationdate><title>Substrate drying apparatus, substrate processing apparatus and substrate drying method capable of reducing the occurrence of pattern clogging with a simple configuration</title><author>MATSUSHITA, JUN ; TARUNO, YOKO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW202314921A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BLASTING</topic><topic>CLEANING</topic><topic>CLEANING IN GENERAL</topic><topic>DRYING</topic><topic>DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HEATING</topic><topic>LIGHTING</topic><topic>MECHANICAL ENGINEERING</topic><topic>PERFORMING OPERATIONS</topic><topic>PREVENTION OF FOULING IN GENERAL</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>MATSUSHITA, JUN</creatorcontrib><creatorcontrib>TARUNO, YOKO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MATSUSHITA, JUN</au><au>TARUNO, YOKO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Substrate drying apparatus, substrate processing apparatus and substrate drying method capable of reducing the occurrence of pattern clogging with a simple configuration</title><date>2023-04-01</date><risdate>2023</risdate><abstract>A piece of substrate drying apparatus, a piece of substrate processing apparatus, and a substrate drying method, capable of reducing the occurrence of pattern clogging with a simple configuration, are provided. A substrate drying device (300) in a substrate processing apparatus (1) includes: a heating section (36); a first volatile solvent supply section (34); a second volatile solvent supply unit (35) supplying a second volatile solvent (H), wherein the second volatile solvent (H) contains a water repellent agent whose surface tension when vaporized is smaller than the first volatile solvent (V); a drying chamber (31) which the substrate (W) is carried into on which the liquid film is formed; a driving mechanism for rotating the substrate (W); and a control device (400). The first volatile solvent (V) supplied from the first volatile solvent supply section (34) is to replace the liquid film, and the second volatile solvent (H) supplid from the second volatile solvent supply unit (35) is to replace the first</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS BLASTING CLEANING CLEANING IN GENERAL DRYING DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEATING LIGHTING MECHANICAL ENGINEERING PERFORMING OPERATIONS PREVENTION OF FOULING IN GENERAL SEMICONDUCTOR DEVICES TRANSPORTING WEAPONS |
| title | Substrate drying apparatus, substrate processing apparatus and substrate drying method capable of reducing the occurrence of pattern clogging with a simple configuration |
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