Package substrate, package, and method of forming semiconductor device

Embodiments provide a package substrate. The package substrate includes a substrate having a cavity hole therein, and a semiconductor device in the cavity hole. The semiconductor device has first terminal side and a second terminal side opposite to the first terminal side. The package substrate furt...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HSU, HUNG-EN, SHEN, WEI-TIEN, HSU, KUOING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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