Package substrate, package, and method of forming semiconductor device

Package substrate, package, and method of forming semiconductor device

Embodiments provide a package substrate. The package substrate includes a substrate having a cavity hole therein, and a semiconductor device in the cavity hole. The semiconductor device has first terminal side and a second terminal side opposite to the first terminal side. The package substrate furt...

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Hauptverfasser: HSU, HUNG-EN, SHEN, WEI-TIEN, HSU, KUOING
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator HSU, HUNG-EN
SHEN, WEI-TIEN
HSU, KUOING
description Embodiments provide a package substrate. The package substrate includes a substrate having a cavity hole therein, and a semiconductor device in the cavity hole. The semiconductor device has first terminal side and a second terminal side opposite to the first terminal side. The package substrate further includes a first redistribution structure on the first terminal side of the cavity substrate to electrically couple to a first pad and a second pad on the first terminal side of the semiconductor device; and a second redistribution structure on the second side of the cavity substrate to electrically couple to a third pad and fourth pad on the second terminal side of the semiconductor device.
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language chi ; eng
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Package substrate, package, and method of forming semiconductor device
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