Pre-mold substrate and method of manufacturing pre-mold substrate

According to an aspect of the present disclosure, there is provided a pre-mold substrate and a method of manufacturing the pre-mold substrate. The pre-mold substrate includes an electroconductive base member, which includes a first pre-mold groove formed in a bottom surface and a second pre-mold gro...

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Bibliographische Detailangaben
Hauptverfasser:	YOO, KWANG-JAE, BAE, IN-SEOB, KU, JONG-HOE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	According to an aspect of the present disclosure, there is provided a pre-mold substrate and a method of manufacturing the pre-mold substrate. The pre-mold substrate includes an electroconductive base member, which includes a first pre-mold groove formed in a bottom surface and a second pre-mold groove formed in a top surface and constitutes a circuit pattern; a first pre-mold resin disposed in the first pre-mold groove; and a second pre-mold resin disposed in the second pre-mold groove. Warpage of a pre-mold substrate of the present disclosure is prevented.