Method of forming cutting portions or removal portions of printed substrate using laser processing capable of preventing processing powder or steam from attaching on printed substrate surface and thus avoiding malfunction of electric devices mounted thereon

The present invention provides a method of forming cutting portions or removal portions of printed substrate using laser processing, which includes: setting a target processing line at a designed position of a printed substrate for displaying the shape of a cutting portion matched with the designed...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ISHII KAZUHISA, NISHIMURA, TOSHIYA, KANAYA, YASUHIKO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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