Flux and solder paste
A flux comprising a base resin, an activator, a thixotropic agent, a solvent, and a solder bonding defect inhibitor, wherein: the solder bonding defect inhibitor is a copolymer including a structural unit represented by formula (1) and a structural unit represented by formula (2); the weight average...
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| creator | NAGAI, TOMOKO ASAMI, AI TAKAGI, KAZUYORI |
| description | A flux comprising a base resin, an activator, a thixotropic agent, a solvent, and a solder bonding defect inhibitor, wherein: the solder bonding defect inhibitor is a copolymer including a structural unit represented by formula (1) and a structural unit represented by formula (2); the weight average molecular weight of the copolymer is 1000-100000; the amount of the solder bonding defect inhibitor with respect to the entirety of the flux is 1-25 mass%; in formula (1), R1 represents a straight chain, branched chain, or cyclic alkyl group that is saturated or unsaturated and has 1-24 carbon atoms, or a substituted or unsubstituted aryl group; in formula (2), R2 represents a group represented by formula (2-1); and, in formula (2-1), n represents an integer of 1-30, R21 represents a hydrogen atom or an alkyl group having 1-6 carbon atoms, and R22 represents a straight chain, branched chain, or cyclic alkylene group having 1-6 carbon atoms. |
| format | Patent |
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the weight average molecular weight of the copolymer is 1000-100000; the amount of the solder bonding defect inhibitor with respect to the entirety of the flux is 1-25 mass%; in formula (1), R1 represents a straight chain, branched chain, or cyclic alkyl group that is saturated or unsaturated and has 1-24 carbon atoms, or a substituted or unsubstituted aryl group; in formula (2), R2 represents a group represented by formula (2-1); and, in formula (2-1), n represents an integer of 1-30, R21 represents a hydrogen atom or an alkyl group having 1-6 carbon atoms, and R22 represents a straight chain, branched chain, or cyclic alkylene group having 1-6 carbon atoms.</description><language>chi ; eng</language><subject>CHEMISTRY ; CLADDING OR PLATING BY SOLDERING OR WELDING ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; PERFORMING OPERATIONS ; SOLDERING OR UNSOLDERING ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; TRANSPORTING ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221016&DB=EPODOC&CC=TW&NR=202239876A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221016&DB=EPODOC&CC=TW&NR=202239876A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NAGAI, TOMOKO</creatorcontrib><creatorcontrib>ASAMI, AI</creatorcontrib><creatorcontrib>TAKAGI, KAZUYORI</creatorcontrib><title>Flux and solder paste</title><description>A flux comprising a base resin, an activator, a thixotropic agent, a solvent, and a solder bonding defect inhibitor, wherein: the solder bonding defect inhibitor is a copolymer including a structural unit represented by formula (1) and a structural unit represented by formula (2); the weight average molecular weight of the copolymer is 1000-100000; the amount of the solder bonding defect inhibitor with respect to the entirety of the flux is 1-25 mass%; in formula (1), R1 represents a straight chain, branched chain, or cyclic alkyl group that is saturated or unsaturated and has 1-24 carbon atoms, or a substituted or unsubstituted aryl group; in formula (2), R2 represents a group represented by formula (2-1); and, in formula (2-1), n represents an integer of 1-30, R21 represents a hydrogen atom or an alkyl group having 1-6 carbon atoms, and R22 represents a straight chain, branched chain, or cyclic alkylene group having 1-6 carbon atoms.</description><subject>CHEMISTRY</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PERFORMING OPERATIONS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>TRANSPORTING</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBB1yymtUEjMS1Eozs9JSS1SKEgsLknlYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxIeFGBkZGxpYW5maOxsSoAQBeeSEW</recordid><startdate>20221016</startdate><enddate>20221016</enddate><creator>NAGAI, TOMOKO</creator><creator>ASAMI, AI</creator><creator>TAKAGI, KAZUYORI</creator><scope>EVB</scope></search><sort><creationdate>20221016</creationdate><title>Flux and solder paste</title><author>NAGAI, TOMOKO ; ASAMI, AI ; TAKAGI, KAZUYORI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW202239876A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>CHEMISTRY</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PERFORMING OPERATIONS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>TRANSPORTING</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>NAGAI, TOMOKO</creatorcontrib><creatorcontrib>ASAMI, AI</creatorcontrib><creatorcontrib>TAKAGI, KAZUYORI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NAGAI, TOMOKO</au><au>ASAMI, AI</au><au>TAKAGI, KAZUYORI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Flux and solder paste</title><date>2022-10-16</date><risdate>2022</risdate><abstract>A flux comprising a base resin, an activator, a thixotropic agent, a solvent, and a solder bonding defect inhibitor, wherein: the solder bonding defect inhibitor is a copolymer including a structural unit represented by formula (1) and a structural unit represented by formula (2); the weight average molecular weight of the copolymer is 1000-100000; the amount of the solder bonding defect inhibitor with respect to the entirety of the flux is 1-25 mass%; in formula (1), R1 represents a straight chain, branched chain, or cyclic alkyl group that is saturated or unsaturated and has 1-24 carbon atoms, or a substituted or unsubstituted aryl group; in formula (2), R2 represents a group represented by formula (2-1); and, in formula (2-1), n represents an integer of 1-30, R21 represents a hydrogen atom or an alkyl group having 1-6 carbon atoms, and R22 represents a straight chain, branched chain, or cyclic alkylene group having 1-6 carbon atoms.</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SOLDERING OR UNSOLDERING THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WELDING WORKING BY LASER BEAM |
| title | Flux and solder paste |
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