Apparatus for post exposure bake of photoresist

A method and apparatus for applying an electric field and/or a magnetic field to a photoresist layer without air gap intervention during photolithography processes is provided herein. The method and apparatus include a chamber body, which is configured to be filled with a process fluid, and a substr...

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Bibliographische Detailangaben
Hauptverfasser: LUBOMIRSKY, DMITRY, BUCHBERGER JR., DOUGLAS A, DUKOVIC, JOHN O, NEMANI, SRINIVAS D
Format: Patent
Sprache:chi ; eng
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