Heat-dissipating semiconductor package and method for manufacturing the same
This invention discloses a heat-dissipating semiconductor package and its manufacturing method. A thermal paste is adhered to a substrate, a heat-dissipating layer of the thermal paste contacts a chip mounted on the substrate to dissipate heat from the chip. An attaching portion of the thermal paste...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | This invention discloses a heat-dissipating semiconductor package and its manufacturing method. A thermal paste is adhered to a substrate, a heat-dissipating layer of the thermal paste contacts a chip mounted on the substrate to dissipate heat from the chip. An attaching portion of the thermal paste is attached on the substrate and surrounds an adhesive layer of the chip to form a space between the attaching portion and the substrate. The space surrounding the adhesive layer is used to accommodate the extruded adhesive layer so as to prevent the adhesive layer from overflowing or protruding from the thermal paste. |
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