Bump forming device, bump forming method, solder ball repairing device and solder ball repairing method capable of inspecting bump defects generated on electrode pads of substrate and re-supplying and repairing solder balls in defective electrode portions for soldering

The purpose of the invention is to provide a highly reliable soldering device and method for forming ultrafine solder bump. The bump forming device of the present invention is a bump forming device for supplying solder balls on electrode pads formed on a substrate and comprises a plasma generating d...

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Bibliographische Detailangaben
Hauptverfasser:	MIZUKOSHI, TAICHI, FUJISE, KAZUHIRO, KAIZU, TAKUYA, MIZUTORI, RYOSUKE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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