Base plate, substrate assembly, method of processing a semiconductor substrate, apparatus for assembling a base plate and a semiconductor substrate, lithographic apparatus

The invention provides a base plate configured to be attached to a semiconductor substrate, whereby the base plate is configured to remain attached to the semiconductor substrate during a sequence of processing steps performed on the semiconductor substrate, and whereby the base plate is made from a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: DE VRIES, GOSSE CHARLES, VAN DER VOORT, DENNIS DOMINIC
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention provides a base plate configured to be attached to a semiconductor substrate, whereby the base plate is configured to remain attached to the semiconductor substrate during a sequence of processing steps performed on the semiconductor substrate, and whereby the base plate is made from a material having a Young's modulus larger than 300 GPa.