Grinding apparatus
A grinding apparatus includes a chuck table that holds under suction a workpiece through a protective tape, where the protective tape is attached to one surface of an annular frame so as to cover an opening of the annular frame and the workpiece is attached to the protective tape on an inner side th...
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creator | HOSHIKAWA, HIROTOSHI |
description | A grinding apparatus includes a chuck table that holds under suction a workpiece through a protective tape, where the protective tape is attached to one surface of an annular frame so as to cover an opening of the annular frame and the workpiece is attached to the protective tape on an inner side than an inner circumferential edge of the opening of the annular frame; a grinding unit that has a grindstone for grinding the workpiece held by the chuck table; and a frame cleaning unit that cleans the other surface located on a side opposite to the one surface of the annular frame obtained after grinding of the workpiece. |
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a grinding unit that has a grindstone for grinding the workpiece held by the chuck table; and a frame cleaning unit that cleans the other surface located on a side opposite to the one surface of the annular frame obtained after grinding of the workpiece.</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CLEANING ; CLEANING IN GENERAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; PERFORMING OPERATIONS ; PREVENTION OF FOULING IN GENERAL ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220601&DB=EPODOC&CC=TW&NR=202221785A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220601&DB=EPODOC&CC=TW&NR=202221785A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HOSHIKAWA, HIROTOSHI</creatorcontrib><title>Grinding apparatus</title><description>A grinding apparatus includes a chuck table that holds under suction a workpiece through a protective tape, where the protective tape is attached to one surface of an annular frame so as to cover an opening of the annular frame and the workpiece is attached to the protective tape on an inner side than an inner circumferential edge of the opening of the annular frame; a grinding unit that has a grindstone for grinding the workpiece held by the chuck table; and a frame cleaning unit that cleans the other surface located on a side opposite to the one surface of the annular frame obtained after grinding of the workpiece.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CLEANING</subject><subject>CLEANING IN GENERAL</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>PERFORMING OPERATIONS</subject><subject>PREVENTION OF FOULING IN GENERAL</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBByL8rMS8nMS1dILChILEosKS3mYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxIeFGBkZGRobmFqaOxsSoAQAKYyBK</recordid><startdate>20220601</startdate><enddate>20220601</enddate><creator>HOSHIKAWA, HIROTOSHI</creator><scope>EVB</scope></search><sort><creationdate>20220601</creationdate><title>Grinding apparatus</title><author>HOSHIKAWA, HIROTOSHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW202221785A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CLEANING</topic><topic>CLEANING IN GENERAL</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>PERFORMING OPERATIONS</topic><topic>PREVENTION OF FOULING IN GENERAL</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>HOSHIKAWA, HIROTOSHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HOSHIKAWA, HIROTOSHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Grinding apparatus</title><date>2022-06-01</date><risdate>2022</risdate><abstract>A grinding apparatus includes a chuck table that holds under suction a workpiece through a protective tape, where the protective tape is attached to one surface of an annular frame so as to cover an opening of the annular frame and the workpiece is attached to the protective tape on an inner side than an inner circumferential edge of the opening of the annular frame; a grinding unit that has a grindstone for grinding the workpiece held by the chuck table; and a frame cleaning unit that cleans the other surface located on a side opposite to the one surface of the annular frame obtained after grinding of the workpiece.</abstract><oa>free_for_read</oa></addata></record> |
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language | chi ; eng |
recordid | cdi_epo_espacenet_TW202221785A |
source | esp@cenet |
subjects | BASIC ELECTRIC ELEMENTS CLEANING CLEANING IN GENERAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS PREVENTION OF FOULING IN GENERAL SEMICONDUCTOR DEVICES TRANSPORTING |
title | Grinding apparatus |
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