Load lock device
A load lock device that comprises a load lock chamber that has a first transfer port that connects to a transfer chamber that is connected to a depressurization processing device and a second transfer port that connects to a loader chamber, a substrate holder that holds a substrate inside the load l...
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| creator | NEGISHI, SATOSHI NOMURA, SATOSHI FUKUDA, NAOYA TODA, TETSURO SOEDA, JUNYA SHIMOKAWA, HIDETOSHI MIURA, JUN TAKAGI, SHINJI KUMAGAI, SHUJI |
| description | A load lock device that comprises a load lock chamber that has a first transfer port that connects to a transfer chamber that is connected to a depressurization processing device and a second transfer port that connects to a loader chamber, a substrate holder that holds a substrate inside the load lock chamber, a drive mechanism that is arranged below the load lock chamber and linked to the substrate holder via a linking member so as to be capable of raising the substrate holder, a long chamber that extends laterally from a lower part of the load lock chamber, and a pump that is arranged below the long chamber and discharges gas from the load lock chamber via the long chamber. The long chamber has a bottom surface that has an opening at a location that is offset from vertically below the substrate holder, and the pump is connected to the opening. |
| format | Patent |
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The long chamber has a bottom surface that has an opening at a location that is offset from vertically below the substrate holder, and the pump is connected to the opening.</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SEMICONDUCTOR DEVICES ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220501&DB=EPODOC&CC=TW&NR=202218032A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220501&DB=EPODOC&CC=TW&NR=202218032A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NEGISHI, SATOSHI</creatorcontrib><creatorcontrib>NOMURA, SATOSHI</creatorcontrib><creatorcontrib>FUKUDA, NAOYA</creatorcontrib><creatorcontrib>TODA, TETSURO</creatorcontrib><creatorcontrib>SOEDA, JUNYA</creatorcontrib><creatorcontrib>SHIMOKAWA, HIDETOSHI</creatorcontrib><creatorcontrib>MIURA, JUN</creatorcontrib><creatorcontrib>TAKAGI, SHINJI</creatorcontrib><creatorcontrib>KUMAGAI, SHUJI</creatorcontrib><title>Load lock device</title><description>A load lock device that comprises a load lock chamber that has a first transfer port that connects to a transfer chamber that is connected to a depressurization processing device and a second transfer port that connects to a loader chamber, a substrate holder that holds a substrate inside the load lock chamber, a drive mechanism that is arranged below the load lock chamber and linked to the substrate holder via a linking member so as to be capable of raising the substrate holder, a long chamber that extends laterally from a lower part of the load lock chamber, and a pump that is arranged below the long chamber and discharges gas from the load lock chamber via the long chamber. 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The long chamber has a bottom surface that has an opening at a location that is offset from vertically below the substrate holder, and the pump is connected to the opening.</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
| recordid | cdi_epo_espacenet_TW202218032A |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | Load lock device |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-04T05%3A24%3A34IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=NEGISHI,%20SATOSHI&rft.date=2022-05-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETW202218032A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |