Curable composition for inkjet, cured product and flexible printed circuit board

A curable composition for inkjet, a cured product and a flexible printed circuit board are provided. The curable composition for inkjet includes a soluble polyimide resin, a photocurable acrylate compound, a photopolymerization initiator, and a thermosetting resin. The curable composition for inkjet...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	LAI, BO-HUNG, SHIH, YUIAO, HUANG, TANGIEH
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COLOUR PRINTING CORRECTING FLUIDS CORRECTION OF TYPOGRAPHICAL ERRORS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME INKS LINING MACHINES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING PERFORMING OPERATIONS POLISHES PRINTED CIRCUITS PRINTING PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES SELECTIVE PRINTING MECHANISMS STAMPS TRANSPORTING TYPEWRITERS USE OF MATERIALS THEREFOR WOODSTAINS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A curable composition for inkjet, a cured product and a flexible printed circuit board are provided. The curable composition for inkjet includes a soluble polyimide resin, a photocurable acrylate compound, a photopolymerization initiator, and a thermosetting resin. The curable composition for inkjet is excellent in flexibility and has a withstand voltage greater than 2 kV when the thickness is less than 20 [mu]m.