Substrate processing device and thermal insulation member for suppressing heat dissipation of a chamber to prevent uneven heating of a substrate

The present invention provides a technique for suppressing heat dissipation of chamber. The substrate processing device (1) is a device for heating a substrate (9). The substrate processing device comprises a chamber (2), a plurality of support pins (3) and a heat plate. The plurality of support pins (3) support the substrate (2) in the chamber (2). The heat plate (4) carries out heating one the substrate supported by the plurality of support pins (3). An inner surface of the chamber (2) is constructed of a first fiber-reinforced resin layer. An surface of the chamber (2) is constructed of a second fiber-reinforced resin layer.