Laser Processing Apparatus
A laser processing apparatus includes a processing nozzle. The processing nozzle includes an upper wall having a laser beam passage port defined therein, a lower wall that is connected to a lower portion of a part of the upper wall and that includes a debris capturing chamber defined therein, a suct...
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| creator | AIDA, KANA KUKI, JUNICHI YOSHII, SHUNGO |
| description | A laser processing apparatus includes a processing nozzle. The processing nozzle includes an upper wall having a laser beam passage port defined therein, a lower wall that is connected to a lower portion of a part of the upper wall and that includes a debris capturing chamber defined therein, a suction port defined between another part of the upper wall and the lower wall, a first air ejection port defined in the lower wall, for ejecting air across the debris capturing chamber toward the suction port in a predetermined direction perpendicular to an optical path of a laser beam, and a second air ejection port defined in the lower wall below the first air ejection port, for ejecting air in the predetermined direction. A flow rate of air ejected from the second air ejection port is smaller than a flow rate of air ejected from the first air ejection port. |
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The processing nozzle includes an upper wall having a laser beam passage port defined therein, a lower wall that is connected to a lower portion of a part of the upper wall and that includes a debris capturing chamber defined therein, a suction port defined between another part of the upper wall and the lower wall, a first air ejection port defined in the lower wall, for ejecting air across the debris capturing chamber toward the suction port in a predetermined direction perpendicular to an optical path of a laser beam, and a second air ejection port defined in the lower wall below the first air ejection port, for ejecting air in the predetermined direction. 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A flow rate of air ejected from the second air ejection port is smaller than a flow rate of air ejected from the first air ejection port.</description><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJDySSxOLVIIKMpPTi0uzsxLV3AsKEgsSiwpLeZhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfEh4UYGRkYGJgbmZo7GxKgBAE0-Iyg</recordid><startdate>20220201</startdate><enddate>20220201</enddate><creator>AIDA, KANA</creator><creator>KUKI, JUNICHI</creator><creator>YOSHII, SHUNGO</creator><scope>EVB</scope></search><sort><creationdate>20220201</creationdate><title>Laser Processing Apparatus</title><author>AIDA, KANA ; KUKI, JUNICHI ; YOSHII, SHUNGO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW202204076A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>AIDA, KANA</creatorcontrib><creatorcontrib>KUKI, JUNICHI</creatorcontrib><creatorcontrib>YOSHII, SHUNGO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>AIDA, KANA</au><au>KUKI, JUNICHI</au><au>YOSHII, SHUNGO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Laser Processing Apparatus</title><date>2022-02-01</date><risdate>2022</risdate><abstract>A laser processing apparatus includes a processing nozzle. The processing nozzle includes an upper wall having a laser beam passage port defined therein, a lower wall that is connected to a lower portion of a part of the upper wall and that includes a debris capturing chamber defined therein, a suction port defined between another part of the upper wall and the lower wall, a first air ejection port defined in the lower wall, for ejecting air across the debris capturing chamber toward the suction port in a predetermined direction perpendicular to an optical path of a laser beam, and a second air ejection port defined in the lower wall below the first air ejection port, for ejecting air in the predetermined direction. A flow rate of air ejected from the second air ejection port is smaller than a flow rate of air ejected from the first air ejection port.</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | Laser Processing Apparatus |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-07T00%3A24%3A01IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=AIDA,%20KANA&rft.date=2022-02-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETW202204076A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |