Linear arrangement for substrate processing tools
A substrate processing system includes a vacuum transfer module and a plurality of process modules defining respective processing chambers. The plurality of process modules includes a first row of the process modules arranged on a first side of the vacuum transfer module and a second row of the proc...
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| creator | PENA, CHRISTOPHER J NENOV, EMIL BROWN, DANNY ARTHUR ORTIZ, MARISSA ELENA KELLOGG, MICHAEL C BRADLEY, BRIAN MWENZE LUONG, KEVIN |
| description | A substrate processing system includes a vacuum transfer module and a plurality of process modules defining respective processing chambers. The plurality of process modules includes a first row of the process modules arranged on a first side of the vacuum transfer module and a second row of the process modules arranged on a second side of the vacuum transfer module opposite the first side. Each of the plurality of process modules includes a gas box arranged above the process module and configured to selectively supply at least one gas and/or gas mixture into the processing chamber of the process module and a radio frequency (RF) generator configured to generate RF power to create plasma within the processing chamber. The RF generator is arranged above the process module and the gas box and the RF generator are arranged side-by-side above the process module. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TW202201463A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TW202201463A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TW202201463A3</originalsourceid><addsrcrecordid>eNrjZDD0ycxLTSxSSCwqSsxLT81NzStRSMsvUiguTSouKUosSVUoKMpPTi0uzsxLVyjJz88p5mFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8SHhRgZGRgaGJmbGjsbEqAEA0jEsVQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Linear arrangement for substrate processing tools</title><source>esp@cenet</source><creator>PENA, CHRISTOPHER J ; NENOV, EMIL ; BROWN, DANNY ARTHUR ; ORTIZ, MARISSA ELENA ; KELLOGG, MICHAEL C ; BRADLEY, BRIAN MWENZE ; LUONG, KEVIN</creator><creatorcontrib>PENA, CHRISTOPHER J ; NENOV, EMIL ; BROWN, DANNY ARTHUR ; ORTIZ, MARISSA ELENA ; KELLOGG, MICHAEL C ; BRADLEY, BRIAN MWENZE ; LUONG, KEVIN</creatorcontrib><description>A substrate processing system includes a vacuum transfer module and a plurality of process modules defining respective processing chambers. The plurality of process modules includes a first row of the process modules arranged on a first side of the vacuum transfer module and a second row of the process modules arranged on a second side of the vacuum transfer module opposite the first side. Each of the plurality of process modules includes a gas box arranged above the process module and configured to selectively supply at least one gas and/or gas mixture into the processing chamber of the process module and a radio frequency (RF) generator configured to generate RF power to create plasma within the processing chamber. The RF generator is arranged above the process module and the gas box and the RF generator are arranged side-by-side above the process module.</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220101&DB=EPODOC&CC=TW&NR=202201463A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220101&DB=EPODOC&CC=TW&NR=202201463A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>PENA, CHRISTOPHER J</creatorcontrib><creatorcontrib>NENOV, EMIL</creatorcontrib><creatorcontrib>BROWN, DANNY ARTHUR</creatorcontrib><creatorcontrib>ORTIZ, MARISSA ELENA</creatorcontrib><creatorcontrib>KELLOGG, MICHAEL C</creatorcontrib><creatorcontrib>BRADLEY, BRIAN MWENZE</creatorcontrib><creatorcontrib>LUONG, KEVIN</creatorcontrib><title>Linear arrangement for substrate processing tools</title><description>A substrate processing system includes a vacuum transfer module and a plurality of process modules defining respective processing chambers. The plurality of process modules includes a first row of the process modules arranged on a first side of the vacuum transfer module and a second row of the process modules arranged on a second side of the vacuum transfer module opposite the first side. Each of the plurality of process modules includes a gas box arranged above the process module and configured to selectively supply at least one gas and/or gas mixture into the processing chamber of the process module and a radio frequency (RF) generator configured to generate RF power to create plasma within the processing chamber. The RF generator is arranged above the process module and the gas box and the RF generator are arranged side-by-side above the process module.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDD0ycxLTSxSSCwqSsxLT81NzStRSMsvUiguTSouKUosSVUoKMpPTi0uzsxLVyjJz88p5mFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8SHhRgZGRgaGJmbGjsbEqAEA0jEsVQ</recordid><startdate>20220101</startdate><enddate>20220101</enddate><creator>PENA, CHRISTOPHER J</creator><creator>NENOV, EMIL</creator><creator>BROWN, DANNY ARTHUR</creator><creator>ORTIZ, MARISSA ELENA</creator><creator>KELLOGG, MICHAEL C</creator><creator>BRADLEY, BRIAN MWENZE</creator><creator>LUONG, KEVIN</creator><scope>EVB</scope></search><sort><creationdate>20220101</creationdate><title>Linear arrangement for substrate processing tools</title><author>PENA, CHRISTOPHER J ; NENOV, EMIL ; BROWN, DANNY ARTHUR ; ORTIZ, MARISSA ELENA ; KELLOGG, MICHAEL C ; BRADLEY, BRIAN MWENZE ; LUONG, KEVIN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW202201463A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>PENA, CHRISTOPHER J</creatorcontrib><creatorcontrib>NENOV, EMIL</creatorcontrib><creatorcontrib>BROWN, DANNY ARTHUR</creatorcontrib><creatorcontrib>ORTIZ, MARISSA ELENA</creatorcontrib><creatorcontrib>KELLOGG, MICHAEL C</creatorcontrib><creatorcontrib>BRADLEY, BRIAN MWENZE</creatorcontrib><creatorcontrib>LUONG, KEVIN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>PENA, CHRISTOPHER J</au><au>NENOV, EMIL</au><au>BROWN, DANNY ARTHUR</au><au>ORTIZ, MARISSA ELENA</au><au>KELLOGG, MICHAEL C</au><au>BRADLEY, BRIAN MWENZE</au><au>LUONG, KEVIN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Linear arrangement for substrate processing tools</title><date>2022-01-01</date><risdate>2022</risdate><abstract>A substrate processing system includes a vacuum transfer module and a plurality of process modules defining respective processing chambers. The plurality of process modules includes a first row of the process modules arranged on a first side of the vacuum transfer module and a second row of the process modules arranged on a second side of the vacuum transfer module opposite the first side. Each of the plurality of process modules includes a gas box arranged above the process module and configured to selectively supply at least one gas and/or gas mixture into the processing chamber of the process module and a radio frequency (RF) generator configured to generate RF power to create plasma within the processing chamber. The RF generator is arranged above the process module and the gas box and the RF generator are arranged side-by-side above the process module.</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Linear arrangement for substrate processing tools |
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