Cover tape for packing electronic component and package

The present disclosure provides a cover tape for packing an electronic component comprising: a substrate layer, a heat sealing layer placed on one surface side of the substrate layer, and an antistatic layer placed on the substrate layer, on an opposite surface side to the heat sealing layer surface...

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Hauptverfasser: INOUE, MASAKUNI, YANAGISAWA, SHUNPEI, NAGATSUKA, YASUNORI
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Sprache:chi ; eng
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creator INOUE, MASAKUNI
YANAGISAWA, SHUNPEI
NAGATSUKA, YASUNORI
description The present disclosure provides a cover tape for packing an electronic component comprising: a substrate layer, a heat sealing layer placed on one surface side of the substrate layer, and an antistatic layer placed on the substrate layer, on an opposite surface side to the heat sealing layer surface, wherein a surface resistivity of the surface side where the antistatic layer is placed is 1 * 1010 [Omega]/□ or less; the heat sealing layer includes an antistatic agent; and a transmittance of a light with an incident angle of 40DEG through the cover tape for packing an electronic component is 80% or more.
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language chi ; eng
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subjects ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS
CONVEYING
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HANDLING THIN OR FILAMENTARY MATERIAL
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PACKAGES
PACKAGING ELEMENTS
PACKING
PERFORMING OPERATIONS
PRINTED CIRCUITS
STORING
TRANSPORTING
title Cover tape for packing electronic component and package
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