Cover tape for packing electronic component and package

The present disclosure provides a cover tape for packing an electronic component comprising: a substrate layer, a heat sealing layer placed on one surface side of the substrate layer, and an antistatic layer placed on the substrate layer, on an opposite surface side to the heat sealing layer surface...

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Bibliographische Detailangaben
Hauptverfasser:	INOUE, MASAKUNI, YANAGISAWA, SHUNPEI, NAGATSUKA, YASUNORI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS CONVEYING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING THIN OR FILAMENTARY MATERIAL LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PACKAGES PACKAGING ELEMENTS PACKING PERFORMING OPERATIONS PRINTED CIRCUITS STORING TRANSPORTING
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Beschreibung
Zusammenfassung:	The present disclosure provides a cover tape for packing an electronic component comprising: a substrate layer, a heat sealing layer placed on one surface side of the substrate layer, and an antistatic layer placed on the substrate layer, on an opposite surface side to the heat sealing layer surface, wherein a surface resistivity of the surface side where the antistatic layer is placed is 1 * 1010 [Omega]/□ or less; the heat sealing layer includes an antistatic agent; and a transmittance of a light with an incident angle of 40DEG through the cover tape for packing an electronic component is 80% or more.