System and method for generation of wafer inspection critical areas

A method includes receiving one or more sets of wafer data, identifying one or more primitives from one or more shapes in one or more layers in the one or more sets of wafer data, classifying each of the one or more primitives as a particular primitive type, identifying one or more primitive charact...

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Bibliographische Detailangaben
Hauptverfasser: KULKARNI, ASHOK V, MANEPALLI, RAJESH, UPPALURI, PRASANTI, KIRKLAND, JOHN, BANERJEE, SAIBAL
Format: Patent
Sprache:chi ; eng
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