Etching method of circuit board and circuit board made by same
An etching method of a circuit board includes: providing an anode, the anode including a product to be etched, the product to be etched is a circuit board; providing a cathode, the cathode having a surface protruding from a periphery of the cathode toward a center of the cathode; immersing the anode...
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creator | HUANG, CHUNIEH HUANG, SHIH-FU HUANG, BAUIN |
description | An etching method of a circuit board includes: providing an anode, the anode including a product to be etched, the product to be etched is a circuit board; providing a cathode, the cathode having a surface protruding from a periphery of the cathode toward a center of the cathode; immersing the anode and the cathode in an electrolyte to keep the anode and the cathode opposite to and spaced apart from each other, the convex surface of the cathode facing the anode; and energizing the anode and the cathode to electrolytically etch the product to be etched. A circuit board obtained by the above etching method is also provided. By designing the shape of the cathode, the problem of uneven electrolytic etching can be effectively overcome. |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TW202144627A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TW202144627A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TW202144627A3</originalsourceid><addsrcrecordid>eNrjZLBzLUnOyMxLV8hNLcnIT1HIT1NIzixKLs0sUUjKTyxKUUjMS0ETyU1MSVVIqlQoTsxN5WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8SHhRgZGhiYmZkbmjsbEqAEABTcv6g</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Etching method of circuit board and circuit board made by same</title><source>esp@cenet</source><creator>HUANG, CHUNIEH ; HUANG, SHIH-FU ; HUANG, BAUIN</creator><creatorcontrib>HUANG, CHUNIEH ; HUANG, SHIH-FU ; HUANG, BAUIN</creatorcontrib><description>An etching method of a circuit board includes: providing an anode, the anode including a product to be etched, the product to be etched is a circuit board; providing a cathode, the cathode having a surface protruding from a periphery of the cathode toward a center of the cathode; immersing the anode and the cathode in an electrolyte to keep the anode and the cathode opposite to and spaced apart from each other, the convex surface of the cathode facing the anode; and energizing the anode and the cathode to electrolytically etch the product to be etched. A circuit board obtained by the above etching method is also provided. By designing the shape of the cathode, the problem of uneven electrolytic etching can be effectively overcome.</description><language>chi ; eng</language><subject>APPARATUS THEREFOR ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; PRINTED CIRCUITS ; PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROMOBJECTS</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211201&DB=EPODOC&CC=TW&NR=202144627A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211201&DB=EPODOC&CC=TW&NR=202144627A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HUANG, CHUNIEH</creatorcontrib><creatorcontrib>HUANG, SHIH-FU</creatorcontrib><creatorcontrib>HUANG, BAUIN</creatorcontrib><title>Etching method of circuit board and circuit board made by same</title><description>An etching method of a circuit board includes: providing an anode, the anode including a product to be etched, the product to be etched is a circuit board; providing a cathode, the cathode having a surface protruding from a periphery of the cathode toward a center of the cathode; immersing the anode and the cathode in an electrolyte to keep the anode and the cathode opposite to and spaced apart from each other, the convex surface of the cathode facing the anode; and energizing the anode and the cathode to electrolytically etch the product to be etched. A circuit board obtained by the above etching method is also provided. By designing the shape of the cathode, the problem of uneven electrolytic etching can be effectively overcome.</description><subject>APPARATUS THEREFOR</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>PRINTED CIRCUITS</subject><subject>PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROMOBJECTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLBzLUnOyMxLV8hNLcnIT1HIT1NIzixKLs0sUUjKTyxKUUjMS0ETyU1MSVVIqlQoTsxN5WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8SHhRgZGhiYmZkbmjsbEqAEABTcv6g</recordid><startdate>20211201</startdate><enddate>20211201</enddate><creator>HUANG, CHUNIEH</creator><creator>HUANG, SHIH-FU</creator><creator>HUANG, BAUIN</creator><scope>EVB</scope></search><sort><creationdate>20211201</creationdate><title>Etching method of circuit board and circuit board made by same</title><author>HUANG, CHUNIEH ; HUANG, SHIH-FU ; HUANG, BAUIN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW202144627A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2021</creationdate><topic>APPARATUS THEREFOR</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>PRINTED CIRCUITS</topic><topic>PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROMOBJECTS</topic><toplevel>online_resources</toplevel><creatorcontrib>HUANG, CHUNIEH</creatorcontrib><creatorcontrib>HUANG, SHIH-FU</creatorcontrib><creatorcontrib>HUANG, BAUIN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HUANG, CHUNIEH</au><au>HUANG, SHIH-FU</au><au>HUANG, BAUIN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Etching method of circuit board and circuit board made by same</title><date>2021-12-01</date><risdate>2021</risdate><abstract>An etching method of a circuit board includes: providing an anode, the anode including a product to be etched, the product to be etched is a circuit board; providing a cathode, the cathode having a surface protruding from a periphery of the cathode toward a center of the cathode; immersing the anode and the cathode in an electrolyte to keep the anode and the cathode opposite to and spaced apart from each other, the convex surface of the cathode facing the anode; and energizing the anode and the cathode to electrolytically etch the product to be etched. A circuit board obtained by the above etching method is also provided. By designing the shape of the cathode, the problem of uneven electrolytic etching can be effectively overcome.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROMOBJECTS |
title | Etching method of circuit board and circuit board made by same |
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