Polishing pads having selectively arranged porosity

Polishing pads having discrete and selectively arranged regions of varying porosity within a continuous phase of polymer material are provided herein. In one embodiment a polishing pad features a plurality of polishing elements each comprising a polishing surface and sidewalls extending downwardly f...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	JAWALI, PUNEET NARENDRA, AN, JOON-HO, FUNG, JASON G, BAJAJ, RAJEEV, KHANNA, ANIRUDDH JAGDISH, MANZONIE, ADAM WADE, KIM, JAE-SEOK, YAMAMURA, MAYU, KAKIREDDY, VEERA RAGHAVA REDDY, BARADANAHALLI KENCHAPPA, NANDAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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