Wafer-bonding structure and method of forming thereof

A method of forming a wafer-bonding structure includes a wafer-bonding step, a through silicon via forming step and a forming bonding pad step. In the wafer-bonding step, each of at least two wafers has a bonding surface, and the wafers are corresponding to and bonded to each other by the bonding su...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WANG, HSINGYA ARTHUR, CHANG, WAN-YI, CHOU, SHENG-YUAN, WANG, YU-TING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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