Semiconductor structure and method of forming thereof

A method of forming a semiconductor structure includes bonding a first die and a second die to a first side of a first interposer and to a first side of a second interposer, respectively, where the first interposer is laterally adjacent to the second interposer; encapsulating the first interposer an...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HOU, SHANG-YUN, TING, KUOIANG, CHEN, WEI-MING CHRIS
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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