Photosensitive resin composition, two-fluid photosensitive resin composition, dry film, and printed wiring board having properties of high heat resistance, and prevention of reduced adhesion strength

The present invention provides a photosensitive resin composition with high heat resistance, prevention property of reduced adhesion strength, and thermal cycling resistance. The photosensitive resin composition of the present invention is characterized in containing: at least one of a carboxyl grou...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SATO, HIROHIDE, ARAI, YASUAKI, IZUMI, SHINICHIRO, SHIMAMIYA, MARIKO, HARIMA, EIJI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention provides a photosensitive resin composition with high heat resistance, prevention property of reduced adhesion strength, and thermal cycling resistance. The photosensitive resin composition of the present invention is characterized in containing: at least one of a carboxyl group-containing resin, talc, and mica; a bifunctional or higher functional (meth) acrylate with an isocyanuric acid ring; an epoxy resin; and a photopolymerization initiator.