Material processing device
To process a material efficiently. A material processing device 10 includes a first tubular member 16 and a second tubular member 24. The first tubular member 16 is at least partially heated to a temperature which is a reaction temperature of a material 100 or higher and discharges water vapor 102 s...
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| creator | TOKIMUNE, AKIRA HAYASHI, KOUJI |
| description | To process a material efficiently. A material processing device 10 includes a first tubular member 16 and a second tubular member 24. The first tubular member 16 is at least partially heated to a temperature which is a reaction temperature of a material 100 or higher and discharges water vapor 102 supplied from the side of a first end part that is one longitudinal end part from the side of a second end part that is the other longitudinal end part. The second tubular member 24 is at least partially disposed thermally contacting with the first tubular member 16, supplied with the material 100 from the side of a third end part that is one longitudinal end part, and supplied with the water vapor 102 discharged from the first tubular member 16 and having the reaction temperature or higher from the side of a fourth end part that is the other longitudinal end part. The second tubular member 24 discharges a recovery object gas 107 that is a reaction product between the material 100 and the water vapor 102. |
| format | Patent |
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The first tubular member 16 is at least partially heated to a temperature which is a reaction temperature of a material 100 or higher and discharges water vapor 102 supplied from the side of a first end part that is one longitudinal end part from the side of a second end part that is the other longitudinal end part. The second tubular member 24 is at least partially disposed thermally contacting with the first tubular member 16, supplied with the material 100 from the side of a third end part that is one longitudinal end part, and supplied with the water vapor 102 discharged from the first tubular member 16 and having the reaction temperature or higher from the side of a fourth end part that is the other longitudinal end part. 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| language | chi ; eng |
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| subjects | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP |
| title | Material processing device |
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