Optical package
The present disclosure provides an optical package comprising a substrate, an image sensor, a microlens, an optical filter layer, a constraining layer, and a buffer layer. The image sensor is disposed on the substrate. The microlens having a first Young's modulus is disposed on the image sensor...
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| creator | TANG, SHIHIEH LAI, LU-MING HSU, CHIA-YUN |
| description | The present disclosure provides an optical package comprising a substrate, an image sensor, a microlens, an optical filter layer, a constraining layer, and a buffer layer. The image sensor is disposed on the substrate. The microlens having a first Young's modulus is disposed on the image sensor. The optical filter layer having a second Young's modulus disposed on the microlens. The constraining layer is disposed between the optical filter layer and the microlens. The buffer layer having a third Young's modulus disposed on the constraining layer. The third Young's modulus is greater than the first Young's modulus and smaller than the second Young's modulus. |
| format | Patent |
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The microlens having a first Young's modulus is disposed on the image sensor. The optical filter layer having a second Young's modulus disposed on the microlens. The constraining layer is disposed between the optical filter layer and the microlens. The buffer layer having a third Young's modulus disposed on the constraining layer. The third Young's modulus is greater than the first Young's modulus and smaller than the second Young's modulus.</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS ; OPTICS ; PHYSICS ; SEMICONDUCTOR DEVICES</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210516&DB=EPODOC&CC=TW&NR=202119643A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210516&DB=EPODOC&CC=TW&NR=202119643A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TANG, SHIHIEH</creatorcontrib><creatorcontrib>LAI, LU-MING</creatorcontrib><creatorcontrib>HSU, CHIA-YUN</creatorcontrib><title>Optical package</title><description>The present disclosure provides an optical package comprising a substrate, an image sensor, a microlens, an optical filter layer, a constraining layer, and a buffer layer. The image sensor is disposed on the substrate. The microlens having a first Young's modulus is disposed on the image sensor. The optical filter layer having a second Young's modulus disposed on the microlens. The constraining layer is disposed between the optical filter layer and the microlens. The buffer layer having a third Young's modulus disposed on the constraining layer. The third Young's modulus is greater than the first Young's modulus and smaller than the second Young's modulus.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</subject><subject>OPTICS</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOD3LyjJTE7MUShITM5OTE_lYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxUBVqXmpJfEh4UYGRoaGlmYmxo7GxKgBAHetHto</recordid><startdate>20210516</startdate><enddate>20210516</enddate><creator>TANG, SHIHIEH</creator><creator>LAI, LU-MING</creator><creator>HSU, CHIA-YUN</creator><scope>EVB</scope></search><sort><creationdate>20210516</creationdate><title>Optical package</title><author>TANG, SHIHIEH ; LAI, LU-MING ; HSU, CHIA-YUN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW202119643A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</topic><topic>OPTICS</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>TANG, SHIHIEH</creatorcontrib><creatorcontrib>LAI, LU-MING</creatorcontrib><creatorcontrib>HSU, CHIA-YUN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TANG, SHIHIEH</au><au>LAI, LU-MING</au><au>HSU, CHIA-YUN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Optical package</title><date>2021-05-16</date><risdate>2021</risdate><abstract>The present disclosure provides an optical package comprising a substrate, an image sensor, a microlens, an optical filter layer, a constraining layer, and a buffer layer. The image sensor is disposed on the substrate. The microlens having a first Young's modulus is disposed on the image sensor. The optical filter layer having a second Young's modulus disposed on the microlens. The constraining layer is disposed between the optical filter layer and the microlens. The buffer layer having a third Young's modulus disposed on the constraining layer. The third Young's modulus is greater than the first Young's modulus and smaller than the second Young's modulus.</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
| recordid | cdi_epo_espacenet_TW202119643A |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS SEMICONDUCTOR DEVICES |
| title | Optical package |
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