Methods of forming integrated circuit devices

Integrated circuit devices and methods of forming the same are provided. A method according to the present disclosure includes providing a workpiece including a first metal feature in a dielectric layer and a capping layer over the first metal feature, selectively depositing a blocking layer over th...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WU, CHIA-TIEN, HUANG, HSIN-YEN, YANG, TAI-I, LEE, CHENGIN, LIU, HSIANG-WEI, LEE, SHAO-KUAN, CHEN, HAIING, SHUE, SHAU-LIN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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