Filp chip package

A flip chip package includes a substrate, a chip body bonding on the substrate and bumps connected between the chip body and the substrate. The substrate includes input wires and output wires. The chip body includes a first package unit including a first seal ring and first pads and a second package...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHENG, PAI-SHENG, TU, WENIEH
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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