Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board
The present invention relates to a photosensitive resin composition which contains a binder polymer, a photopolymerizable compound and a photopolymerization initiator. The binder polymer contains a structural unit derived from a (meth)acrylate compound having a dicyclopentanyl group.
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| creator | SUNOHARA, SEIJI KURODA, AYAKA |
| description | The present invention relates to a photosensitive resin composition which contains a binder polymer, a photopolymerizable compound and a photopolymerization initiator. The binder polymer contains a structural unit derived from a (meth)acrylate compound having a dicyclopentanyl group. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TW202040272A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TW202040272A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TW202040272A3</originalsourceid><addsrcrecordid>eNqNi7EKwkAQRNNYiPoPax8hnIK1iGJpEbAMZ25jDnK7x96q_-BX64mFdhbDMMN74-Jx7Fk5ISWv_oYgmDxByyFyfphKiL8EDhiQtISA2rODjiUneLq87aQQrSrKS7XkvrEo7K5tBqN4UnRw95Lnma24aTHq7JBw9ulJMd_v6u1hgZEbTNG2SKhNfTKVqVaVWZvN8h_mCXVgTlw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board</title><source>esp@cenet</source><creator>SUNOHARA, SEIJI ; KURODA, AYAKA</creator><creatorcontrib>SUNOHARA, SEIJI ; KURODA, AYAKA</creatorcontrib><description>The present invention relates to a photosensitive resin composition which contains a binder polymer, a photopolymerizable compound and a photopolymerization initiator. The binder polymer contains a structural unit derived from a (meth)acrylate compound having a dicyclopentanyl group.</description><language>chi ; eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CINEMATOGRAPHY ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201101&DB=EPODOC&CC=TW&NR=202040272A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201101&DB=EPODOC&CC=TW&NR=202040272A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SUNOHARA, SEIJI</creatorcontrib><creatorcontrib>KURODA, AYAKA</creatorcontrib><title>Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board</title><description>The present invention relates to a photosensitive resin composition which contains a binder polymer, a photopolymerizable compound and a photopolymerization initiator. The binder polymer contains a structural unit derived from a (meth)acrylate compound having a dicyclopentanyl group.</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MATERIALS THEREFOR</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNi7EKwkAQRNNYiPoPax8hnIK1iGJpEbAMZ25jDnK7x96q_-BX64mFdhbDMMN74-Jx7Fk5ISWv_oYgmDxByyFyfphKiL8EDhiQtISA2rODjiUneLq87aQQrSrKS7XkvrEo7K5tBqN4UnRw95Lnma24aTHq7JBw9ulJMd_v6u1hgZEbTNG2SKhNfTKVqVaVWZvN8h_mCXVgTlw</recordid><startdate>20201101</startdate><enddate>20201101</enddate><creator>SUNOHARA, SEIJI</creator><creator>KURODA, AYAKA</creator><scope>EVB</scope></search><sort><creationdate>20201101</creationdate><title>Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board</title><author>SUNOHARA, SEIJI ; KURODA, AYAKA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW202040272A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2020</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MATERIALS THEREFOR</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>SUNOHARA, SEIJI</creatorcontrib><creatorcontrib>KURODA, AYAKA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SUNOHARA, SEIJI</au><au>KURODA, AYAKA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board</title><date>2020-11-01</date><risdate>2020</risdate><abstract>The present invention relates to a photosensitive resin composition which contains a binder polymer, a photopolymerizable compound and a photopolymerization initiator. The binder polymer contains a structural unit derived from a (meth)acrylate compound having a dicyclopentanyl group.</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
| recordid | cdi_epo_espacenet_TW202040272A |
| source | esp@cenet |
| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-06T16%3A17%3A45IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SUNOHARA,%20SEIJI&rft.date=2020-11-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETW202040272A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |