Method of forming and packaging semiconductor die

A manufacturing and packaging method for a semiconductor die is provided. The method prepares a wafer which has a seal-ring region, forms a first interlayer insulating film on the wafer, forms a metal wiring in the first interlayer insulating film, forms a second interlayer insulating film on the fi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	BAE, JIN-HAN, JEONG, JIN-WON, SHIM, DONG-KI, CHOI, JAE-SIK, SONG, BYEUNG-SOO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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