Method for setting a pressure in a cavity formed with the aid of a substrate and a substrate cap, system
Method for setting a pressure in a cavity (10) formed with the aid of a substrate (1) and a substrate cap (2), wherein a microelectromechanical system (3) is arranged in the cavity (10), wherein the substrate (1) has a main plane of extent (100), wherein the method comprises the following steps: in...
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| creator | FERRE I TOMAS, RAFEL KRONENBERGER, ACHIM STAFFELD, PETER BORWIN |
| description | Method for setting a pressure in a cavity (10) formed with the aid of a substrate (1) and a substrate cap (2), wherein a microelectromechanical system (3) is arranged in the cavity (10), wherein the substrate (1) has a main plane of extent (100), wherein the method comprises the following steps: in a first step, a cutout (20) is produced in the substrate cap (2), wherein the cutout (20) connects the cavity (10) to an environment (12), wherein a first cutout end (21) of the cutout (20) is formed at a first surface (4) of the substrate cap (2), said first surface facing away from the cavity, wherein a second cutout end (22) of the cutout (20) is formed at a cavity-side second surface (5) of the substrate cap (2), wherein the first cutout end (21) and the second cutout end (22) are spaced apart from one another at least in a first direction (200) parallel to the main plane of extent (100), in a second step, after the first step, the cutout (20) is closed. |
| format | Patent |
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| subjects | MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS TRANSPORTING |
| title | Method for setting a pressure in a cavity formed with the aid of a substrate and a substrate cap, system |
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