Workpiece holding method and workpiece processing method

A workpiece holding method for a workpiece having a bowl-shaped warp includes a mounting step of mounting the workpiece on a holding unit having a holding surface, a suction hole opening to the holding surface, and a suction passage for making selective communication between the suction hole and a v...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: ATENDIDO, PAUL VINCENT, MIYAGI, YUSUKE
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator ATENDIDO, PAUL VINCENT
MIYAGI, YUSUKE
description A workpiece holding method for a workpiece having a bowl-shaped warp includes a mounting step of mounting the workpiece on a holding unit having a holding surface, a suction hole opening to the holding surface, and a suction passage for making selective communication between the suction hole and a vacuum source for producing a suction force, the workpiece being mounted on the holding surface of the holding unit, a liquid supplying step of supplying a liquid to the workpiece held on the holding surface so that the liquid flows into a gap defined between the holding surface and the workpiece to fill the gap, and a suction step of bringing the suction hole into communication with the vacuum source to suck the liquid and the workpiece and thereby hold the workpiece through the liquid on the holding surface under suction, after performing the liquid supplying step.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TW202027178A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TW202027178A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TW202027178A3</originalsourceid><addsrcrecordid>eNrjZLAIzy_KLshMTU5VyMjPScnMS1fITS3JyE9RSMxLUSiHSxYU5SenFhcj5HkYWNMSc4pTeaE0N4Oim2uIs4duakF-fGpxQWJyal5qSXxIuJEBEJobmls4GhOjBgA4Qi7W</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Workpiece holding method and workpiece processing method</title><source>esp@cenet</source><creator>ATENDIDO, PAUL VINCENT ; MIYAGI, YUSUKE</creator><creatorcontrib>ATENDIDO, PAUL VINCENT ; MIYAGI, YUSUKE</creatorcontrib><description>A workpiece holding method for a workpiece having a bowl-shaped warp includes a mounting step of mounting the workpiece on a holding unit having a holding surface, a suction hole opening to the holding surface, and a suction passage for making selective communication between the suction hole and a vacuum source for producing a suction force, the workpiece being mounted on the holding surface of the holding unit, a liquid supplying step of supplying a liquid to the workpiece held on the holding surface so that the liquid flows into a gap defined between the holding surface and the workpiece to fill the gap, and a suction step of bringing the suction hole into communication with the vacuum source to suck the liquid and the workpiece and thereby hold the workpiece through the liquid on the holding surface under suction, after performing the liquid supplying step.</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CONVEYING ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; HANDLING THIN OR FILAMENTARY MATERIAL ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PACKING ; PERFORMING OPERATIONS ; PNEUMATIC TUBE CONVEYORS ; POLISHING ; SEMICONDUCTOR DEVICES ; SHOP CONVEYOR SYSTEMS ; STORING ; TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING ; TRANSPORTING</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20200716&amp;DB=EPODOC&amp;CC=TW&amp;NR=202027178A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20200716&amp;DB=EPODOC&amp;CC=TW&amp;NR=202027178A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ATENDIDO, PAUL VINCENT</creatorcontrib><creatorcontrib>MIYAGI, YUSUKE</creatorcontrib><title>Workpiece holding method and workpiece processing method</title><description>A workpiece holding method for a workpiece having a bowl-shaped warp includes a mounting step of mounting the workpiece on a holding unit having a holding surface, a suction hole opening to the holding surface, and a suction passage for making selective communication between the suction hole and a vacuum source for producing a suction force, the workpiece being mounted on the holding surface of the holding unit, a liquid supplying step of supplying a liquid to the workpiece held on the holding surface so that the liquid flows into a gap defined between the holding surface and the workpiece to fill the gap, and a suction step of bringing the suction hole into communication with the vacuum source to suck the liquid and the workpiece and thereby hold the workpiece through the liquid on the holding surface under suction, after performing the liquid supplying step.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CONVEYING</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>HANDLING THIN OR FILAMENTARY MATERIAL</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PACKING</subject><subject>PERFORMING OPERATIONS</subject><subject>PNEUMATIC TUBE CONVEYORS</subject><subject>POLISHING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SHOP CONVEYOR SYSTEMS</subject><subject>STORING</subject><subject>TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAIzy_KLshMTU5VyMjPScnMS1fITS3JyE9RSMxLUSiHSxYU5SenFhcj5HkYWNMSc4pTeaE0N4Oim2uIs4duakF-fGpxQWJyal5qSXxIuJEBEJobmls4GhOjBgA4Qi7W</recordid><startdate>20200716</startdate><enddate>20200716</enddate><creator>ATENDIDO, PAUL VINCENT</creator><creator>MIYAGI, YUSUKE</creator><scope>EVB</scope></search><sort><creationdate>20200716</creationdate><title>Workpiece holding method and workpiece processing method</title><author>ATENDIDO, PAUL VINCENT ; MIYAGI, YUSUKE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW202027178A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CONVEYING</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>HANDLING THIN OR FILAMENTARY MATERIAL</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PACKING</topic><topic>PERFORMING OPERATIONS</topic><topic>PNEUMATIC TUBE CONVEYORS</topic><topic>POLISHING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SHOP CONVEYOR SYSTEMS</topic><topic>STORING</topic><topic>TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>ATENDIDO, PAUL VINCENT</creatorcontrib><creatorcontrib>MIYAGI, YUSUKE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ATENDIDO, PAUL VINCENT</au><au>MIYAGI, YUSUKE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Workpiece holding method and workpiece processing method</title><date>2020-07-16</date><risdate>2020</risdate><abstract>A workpiece holding method for a workpiece having a bowl-shaped warp includes a mounting step of mounting the workpiece on a holding unit having a holding surface, a suction hole opening to the holding surface, and a suction passage for making selective communication between the suction hole and a vacuum source for producing a suction force, the workpiece being mounted on the holding surface of the holding unit, a liquid supplying step of supplying a liquid to the workpiece held on the holding surface so that the liquid flows into a gap defined between the holding surface and the workpiece to fill the gap, and a suction step of bringing the suction hole into communication with the vacuum source to suck the liquid and the workpiece and thereby hold the workpiece through the liquid on the holding surface under suction, after performing the liquid supplying step.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_TW202027178A
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
CONVEYING
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
HANDLING THIN OR FILAMENTARY MATERIAL
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PACKING
PERFORMING OPERATIONS
PNEUMATIC TUBE CONVEYORS
POLISHING
SEMICONDUCTOR DEVICES
SHOP CONVEYOR SYSTEMS
STORING
TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING
TRANSPORTING
title Workpiece holding method and workpiece processing method
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-02T17%3A57%3A38IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=ATENDIDO,%20PAUL%20VINCENT&rft.date=2020-07-16&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETW202027178A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true