Methods and apparatus for controlling warpage in wafer level packaging processes

Methods and apparatus for producing fine pitch patterning on a substrate. Warpage correction of the substrate is accomplished on a carrier or carrier-less substrate. A first warpage correction process is performed on the substrate by raising and holding a temperature of the substrate to a first temp...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	RAFI, MOHAMED, ELUMALAI, KARTHIK, SULAIMAN, MUHAMMAD ASIM BIN SYED, ANG, YU XIN KRISTY, LIANTO, PRAYUDI, SEE, GUAN HUEI, SUNDARRAJAN, ARVIND, THIRUNAVUKARASU, SRISKANTHARAJAH
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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