Semiconductor package and method of manufacturing the same

A semiconductor package includes a redistribution structure, at least one semiconductor device, a heat dissipation component, and an encapsulating material. The at least one semiconductor device is disposed on and electrically connected to the redistribution structure. The heat dissipation component...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHEN, SHIH-WEI, CHEN, CHIH-HUA, KUO, TIN-HAO, CHUANG, LI-PU KRIS, TSAI, HAO-YI, PAN, HSIN-YU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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