Resist underlayer composition, and method of forming patterns using the composition

Disclosed is a resist underlayer composition including a polymer including at least one of a first moiety represented by Chemical Formula 1-1 and a second moiety represented by Chemical Formula 1-2; a thermal acid generator including a salt composed of an acid-derived anion and a cation derived from...

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Hauptverfasser: PARK, HYEON, KWON, SOON-HYUNG, BAEK, JAE-YEOL, BAE, SHIN-HYO, CHOI, YOO-JEONG
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creator PARK, HYEON
KWON, SOON-HYUNG
BAEK, JAE-YEOL
BAE, SHIN-HYO
CHOI, YOO-JEONG
description Disclosed is a resist underlayer composition including a polymer including at least one of a first moiety represented by Chemical Formula 1-1 and a second moiety represented by Chemical Formula 1-2; a thermal acid generator including a salt composed of an acid-derived anion and a cation derived from a base having pKa of greater than or equal to 7; and a solvent and a method of forming patterns using the resist underlayer composition: Definitions of Chemical Formula 1-1 to Chemical Formula 1-2 are the same as described in the detailed description.
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subjects APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CHEMISTRY
CINEMATOGRAPHY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
MATERIALS THEREFOR
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
title Resist underlayer composition, and method of forming patterns using the composition
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