Resin molding apparatus and method for manufacturing resin molded product
There is provided a resin molding apparatus and a method for manufacturing a resin molded product, capable of positioning an object to be molded on a mold chase with high precision. The resin molding apparatus is a resin molding apparatus which transfer-molds an object to be molded, the object inclu...
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creator | TAKAHASHI, TAKAFUMI KUMAMI, HIROKI OGAWA, KEISUKE KANAMARU, HIROYUKI |
description | There is provided a resin molding apparatus and a method for manufacturing a resin molded product, capable of positioning an object to be molded on a mold chase with high precision. The resin molding apparatus is a resin molding apparatus which transfer-molds an object to be molded, the object including a metal portion, and includes: an upper mold chase; a lower mold chase facing the upper mold chase and including a cavity; a transport mechanism configured to transport the object between the upper mold chase and the lower mold chase; a first protrusion member provided at a position corresponding to the metal portion of the object, and protrusible from an upper surface of the lower mold chase; a second protrusion member protrusible from a bottom surface of the cavity; a drive mechanism capable of controlling independently an amount by which the first protrusion member protrudes from the upper surface of the lower mold chase and an amount by which the second protrusion member protrudes from the bottom surface o |
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language | chi ; eng |
recordid | cdi_epo_espacenet_TW202000417A |
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subjects | AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
title | Resin molding apparatus and method for manufacturing resin molded product |
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