Bonding equipment

Bonding equipment

Bonding equipment includes a laminar flow source, a chip handling portion, a cleaning portion for cleaning a chip, a bonding portion for bonding the chip and a substrate, and a transfer mechanism for transferring the chip from the chip handling portion to the bonding portion. Among these, at least t...

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Hauptverfasser: MATSUO, TAKANOBU, IGUCHI, KATSUJI, MAEGAWA, MASUMI, HIGASHISAKA, HIROYOSHI, SAWAI, KEIICHI
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator MATSUO, TAKANOBU
IGUCHI, KATSUJI
MAEGAWA, MASUMI
HIGASHISAKA, HIROYOSHI
SAWAI, KEIICHI
description Bonding equipment includes a laminar flow source, a chip handling portion, a cleaning portion for cleaning a chip, a bonding portion for bonding the chip and a substrate, and a transfer mechanism for transferring the chip from the chip handling portion to the bonding portion. Among these, at least the bonding portion and the cleaning portion are disposed in a laminar flow by the laminar flow source.
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language chi ; eng
recordid cdi_epo_espacenet_TW201939629A
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Bonding equipment
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