Protective film composition and method of manufacturing semiconductor package by using the same
A protective film composition includes a polymer having the following formula: each of a, b, and c is a mole fraction; a+b+c=1; 0.05 ≤ a/(a+b+c) ≤ 0.3; 0.1 ≤ b/(a+b+c) ≤ 0.6; 0.1 ≤ c/(a+b+c) ≤ 0.6; each of R1, R2, and R3 is a hydrogen atom or a methyl group; R4 is a hydrogen atom, a butyrolactonyl g...
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| creator | OH, KYEONG-IL KANG, CHANG-KUN KIM, JAE-HYUN EUM, MYOUNGUL LEE, HYE-KYOUNG OH, SEUNG-KEUN LEE, CHI-HWAN |
| description | A protective film composition includes a polymer having the following formula: each of a, b, and c is a mole fraction; a+b+c=1; 0.05 ≤ a/(a+b+c) ≤ 0.3; 0.1 ≤ b/(a+b+c) ≤ 0.6; 0.1 ≤ c/(a+b+c) ≤ 0.6; each of R1, R2, and R3 is a hydrogen atom or a methyl group; R4 is a hydrogen atom, a butyrolactonyl group, or a substituted or unsubstituted C3 to C30 alicyclic hydrocarbon group; and R5 is a substituted or unsubstituted C6 to C30 linear or cyclic hydrocarbon group. A method of manufacturing a semiconductor package includes forming a sawing protective film on a semiconductor structure by using the protective film composition and sawing the sawing protective film and the semiconductor structure from the sawing protective film. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TW201934683A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TW201934683A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TW201934683A3</originalsourceid><addsrcrecordid>eNqNizEKAjEQANNYiPqH9QGCGhEtRRRLiwPLsOY2d8FLNiQbwd-r4AOsppiZsTLXzEJW_JPA-SGA5ZC4ePEcAWMLgaTnFthBwFgdWqnZxw4KBW85ttUKZ0hoH9gR3F9Qy1dLT1Aw0FSNHA6FZj9O1Px8ao6XBSU2VD4fRRLT3NbL1V5vtjt90P80b-BmPbM</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Protective film composition and method of manufacturing semiconductor package by using the same</title><source>esp@cenet</source><creator>OH, KYEONG-IL ; KANG, CHANG-KUN ; KIM, JAE-HYUN ; EUM, MYOUNGUL ; LEE, HYE-KYOUNG ; OH, SEUNG-KEUN ; LEE, CHI-HWAN</creator><creatorcontrib>OH, KYEONG-IL ; KANG, CHANG-KUN ; KIM, JAE-HYUN ; EUM, MYOUNGUL ; LEE, HYE-KYOUNG ; OH, SEUNG-KEUN ; LEE, CHI-HWAN</creatorcontrib><description>A protective film composition includes a polymer having the following formula: each of a, b, and c is a mole fraction; a+b+c=1; 0.05 ≤ a/(a+b+c) ≤ 0.3; 0.1 ≤ b/(a+b+c) ≤ 0.6; 0.1 ≤ c/(a+b+c) ≤ 0.6; each of R1, R2, and R3 is a hydrogen atom or a methyl group; R4 is a hydrogen atom, a butyrolactonyl group, or a substituted or unsubstituted C3 to C30 alicyclic hydrocarbon group; and R5 is a substituted or unsubstituted C6 to C30 linear or cyclic hydrocarbon group. A method of manufacturing a semiconductor package includes forming a sawing protective film on a semiconductor structure by using the protective film composition and sawing the sawing protective film and the semiconductor structure from the sawing protective film.</description><language>chi ; eng</language><subject>ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CHEMICAL PAINT OR INK REMOVERS ; CHEMISTRY ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; CORRECTING FLUIDS ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FILLING PASTES ; INKS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; POLISHES ; SEMICONDUCTOR DEVICES ; USE OF MATERIALS THEREFOR ; WOODSTAINS</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190901&DB=EPODOC&CC=TW&NR=201934683A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190901&DB=EPODOC&CC=TW&NR=201934683A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OH, KYEONG-IL</creatorcontrib><creatorcontrib>KANG, CHANG-KUN</creatorcontrib><creatorcontrib>KIM, JAE-HYUN</creatorcontrib><creatorcontrib>EUM, MYOUNGUL</creatorcontrib><creatorcontrib>LEE, HYE-KYOUNG</creatorcontrib><creatorcontrib>OH, SEUNG-KEUN</creatorcontrib><creatorcontrib>LEE, CHI-HWAN</creatorcontrib><title>Protective film composition and method of manufacturing semiconductor package by using the same</title><description>A protective film composition includes a polymer having the following formula: each of a, b, and c is a mole fraction; a+b+c=1; 0.05 ≤ a/(a+b+c) ≤ 0.3; 0.1 ≤ b/(a+b+c) ≤ 0.6; 0.1 ≤ c/(a+b+c) ≤ 0.6; each of R1, R2, and R3 is a hydrogen atom or a methyl group; R4 is a hydrogen atom, a butyrolactonyl group, or a substituted or unsubstituted C3 to C30 alicyclic hydrocarbon group; and R5 is a substituted or unsubstituted C6 to C30 linear or cyclic hydrocarbon group. A method of manufacturing a semiconductor package includes forming a sawing protective film on a semiconductor structure by using the protective film composition and sawing the sawing protective film and the semiconductor structure from the sawing protective film.</description><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL PAINT OR INK REMOVERS</subject><subject>CHEMISTRY</subject><subject>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</subject><subject>CORRECTING FLUIDS</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FILLING PASTES</subject><subject>INKS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>PAINTS</subject><subject>PASTES OR SOLIDS FOR COLOURING OR PRINTING</subject><subject>POLISHES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>USE OF MATERIALS THEREFOR</subject><subject>WOODSTAINS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNizEKAjEQANNYiPqH9QGCGhEtRRRLiwPLsOY2d8FLNiQbwd-r4AOsppiZsTLXzEJW_JPA-SGA5ZC4ePEcAWMLgaTnFthBwFgdWqnZxw4KBW85ttUKZ0hoH9gR3F9Qy1dLT1Aw0FSNHA6FZj9O1Px8ao6XBSU2VD4fRRLT3NbL1V5vtjt90P80b-BmPbM</recordid><startdate>20190901</startdate><enddate>20190901</enddate><creator>OH, KYEONG-IL</creator><creator>KANG, CHANG-KUN</creator><creator>KIM, JAE-HYUN</creator><creator>EUM, MYOUNGUL</creator><creator>LEE, HYE-KYOUNG</creator><creator>OH, SEUNG-KEUN</creator><creator>LEE, CHI-HWAN</creator><scope>EVB</scope></search><sort><creationdate>20190901</creationdate><title>Protective film composition and method of manufacturing semiconductor package by using the same</title><author>OH, KYEONG-IL ; KANG, CHANG-KUN ; KIM, JAE-HYUN ; EUM, MYOUNGUL ; LEE, HYE-KYOUNG ; OH, SEUNG-KEUN ; LEE, CHI-HWAN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW201934683A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2019</creationdate><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL PAINT OR INK REMOVERS</topic><topic>CHEMISTRY</topic><topic>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</topic><topic>CORRECTING FLUIDS</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FILLING PASTES</topic><topic>INKS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>PAINTS</topic><topic>PASTES OR SOLIDS FOR COLOURING OR PRINTING</topic><topic>POLISHES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>USE OF MATERIALS THEREFOR</topic><topic>WOODSTAINS</topic><toplevel>online_resources</toplevel><creatorcontrib>OH, KYEONG-IL</creatorcontrib><creatorcontrib>KANG, CHANG-KUN</creatorcontrib><creatorcontrib>KIM, JAE-HYUN</creatorcontrib><creatorcontrib>EUM, MYOUNGUL</creatorcontrib><creatorcontrib>LEE, HYE-KYOUNG</creatorcontrib><creatorcontrib>OH, SEUNG-KEUN</creatorcontrib><creatorcontrib>LEE, CHI-HWAN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OH, KYEONG-IL</au><au>KANG, CHANG-KUN</au><au>KIM, JAE-HYUN</au><au>EUM, MYOUNGUL</au><au>LEE, HYE-KYOUNG</au><au>OH, SEUNG-KEUN</au><au>LEE, CHI-HWAN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Protective film composition and method of manufacturing semiconductor package by using the same</title><date>2019-09-01</date><risdate>2019</risdate><abstract>A protective film composition includes a polymer having the following formula: each of a, b, and c is a mole fraction; a+b+c=1; 0.05 ≤ a/(a+b+c) ≤ 0.3; 0.1 ≤ b/(a+b+c) ≤ 0.6; 0.1 ≤ c/(a+b+c) ≤ 0.6; each of R1, R2, and R3 is a hydrogen atom or a methyl group; R4 is a hydrogen atom, a butyrolactonyl group, or a substituted or unsubstituted C3 to C30 alicyclic hydrocarbon group; and R5 is a substituted or unsubstituted C6 to C30 linear or cyclic hydrocarbon group. A method of manufacturing a semiconductor package includes forming a sawing protective film on a semiconductor structure by using the protective film composition and sawing the sawing protective film and the semiconductor structure from the sawing protective film.</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | ADHESIVES BASIC ELECTRIC ELEMENTS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS CORRECTING FLUIDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES INKS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS THEREFOR WOODSTAINS |
| title | Protective film composition and method of manufacturing semiconductor package by using the same |
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